Auto-correcting Thermal Control Elements in Semiconductor Substrate Support
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Solution Overview
Problem
Plasma processing systems in semiconductor fabrication face challenges in achieving high accuracy and repeatability, particularly in maintaining uniformity and temperature control during etch and deposition processes, due to the risk of malfunctioning thermal control elements in substrate support assemblies.
Innovation Solution
A method for auto-correction of malfunctioning thermal control elements, where a control unit detects and deactivates the faulty elements and adjusts the power levels of functioning elements to minimize the impact on temperature output, using a unit response matrix to optimize thermal control in the substrate support assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal control elements are used to control substrate temperature during plasma processing, then temperature uniformity and processing accuracy are improved, but the risk of element malfunction increases system reliability concerns
Solution Approach 1:
The system continuously monitors the temperature output of each thermal control element and compares it against desired setpoints. When a malfunction is detected, the control unit receives feedback signals and automatically adjusts the power distribution to compensate for the faulty element, maintaining overall temperature uniformity without manual intervention
Solution Approach 2:
The control unit dynamically changes the power parameters supplied to thermal control elements based on their operational status. When an element malfunctions, the system modifies the power levels of adjacent or compensating elements to maintain the desired temperature profile, effectively adapting to the changed system conditions
2Reliability
If manual detection and replacement of malfunctioning thermal control elements is performed, then system reliability is maintained, but productivity and operational efficiency decrease
Solution Approach 1:
The control unit automatically detects malfunctions in thermal control elements and performs self-correction by redistributing power to functioning elements. This self-service capability eliminates the need for manual detection and replacement, allowing the system to maintain reliability while continuing uninterrupted operation and preserving productivity
Solution Approach 2:
The system performs preliminary detection of element status continuously during operation. When a malfunction is detected, the control unit immediately takes corrective action by adjusting power distribution before the malfunction can significantly impact processing, preventing downtime and maintaining operational efficiency
3Manufacturing precision
If the array of thermal control elements is increased to improve temperature control coverage, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
Instead of adding more physical elements, the system achieves improved temperature control coverage by dynamically changing the power parameters of existing elements. The control unit adjusts power distribution across the array to compensate for malfunctions and optimize thermal coverage, maintaining precision without increasing device complexity
Solution Approach 2:
Each thermal control element in the array is designed to perform multiple functions: normal heating, compensating for adjacent element failures, and providing redundancy. This multi-functionality allows the system to maintain comprehensive temperature control coverage using the same existing elements rather than requiring additional dedicated components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the impact of failed thermal control elements on temperature uniformity, maintaining desired temperature profiles and increasing chip yield by automating the correction process, thereby reducing hardware costs and human error.
Implementation Method 1
modifying a power level of at least one functioning thermal control element in the temperature control plate
Data Source
AI summary
A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method including: detecting, by a control unit including a processor, that at least one thermal control element of the array of thermal control elements is malfunctioning; deactivating, by the control unit, the at least one malfunctioning thermal control element; and modifying, by the control unit, a power level of at least one functioning thermal control element in the temperature control plate to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element.