Thermal Control Switch for Power Equipment Heat Management
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Solution Overview
Problem
Existing power equipment in communication systems lack effective thermal insulation at low temperatures, requiring additional heating or cooling devices to maintain stable operation, while existing solutions only provide good heat dissipation at high temperatures.
Innovation Solution
A heat control device comprising a heat source, heat sink substrate, thermal insulation layer, dissipation heat sink, and thermal control switch with high heat transfer performance elements that adjust conductivity based on temperature, using materials like heat pipes or thermal columns, and low thermal conductivity materials to achieve both high-temperature dissipation and low-temperature insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal insulation measure is added for low temperature environment, then thermal insulation performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the thermal insulation layer with the existing heat dissipation structure by placing the insulation layer around the heat sink substrate and using the same structural framework for both high-temperature heat dissipation and low-temperature thermal insulation functions, thereby achieving dual functionality without significantly increasing device complexity
Solution Approach 2:
The heat sink substrate serves dual purposes: it acts as a heat dissipation component at high temperatures and as a platform for the thermal insulation layer at low temperatures. The control switch also serves multiple functions by regulating heat transfer in both heating and cooling modes, making the system universally applicable across different temperature conditions
2Reliability
If heater or thermoelectric cooler is added for thermal insulation, then thermal insulation performance is improved, but device complexity and cost increase
Solution Approach 1:
The system uses the heat source itself to provide thermal insulation at low temperatures by controlling the heat transfer through the thermal control switch. When the switch allows heat transfer, the heat source's own thermal energy is utilized to maintain temperature, eliminating the need for separate heating devices
Solution Approach 2:
The patent changes the thermal conductivity parameter of the thermal control switch based on temperature conditions. At low temperatures, the switch material exhibits high thermal conductivity to allow heat transfer from the heat source, while at high temperatures, it transitions to low thermal conductivity for heat dissipation, thereby achieving thermal insulation without additional heating components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures reliable thermal insulation at low temperatures and efficient heat dissipation at high temperatures, maintaining stable operation of power equipment with easy manufacturing and low costs.
Implementation Method 1
The high heat transfer performance element comprises heat-conductive heat pipes or thermal columns
Implementation Method 2
the thermal insulation layer is made up of clearances and thermal insulation material filled within the clearances around the heat source
Implementation Method 3
the thermal insulation layer is made up of closed stagnant air layer between the heat sink substrate and the high heat-conductive material device
Implementation Method 4
another end of high heat transfer performance element is embedded in the dissipation heat sink
Data Source
Figure 1~3
AI summary
This invention involves and discloses a heat control device for power equipment, which comprises heat source, heat sink base plate, heat insulation layer, dissipation heat sink and thermal control switch, wherein the heat source is placed on and in contact with dissipation heat sink, and its bottom is in direct lap joint with heat sink base plate, wherein the heat insulation layer is set around heat sink base plate, wherein the thermal control switch is placed on heat sink base plate. This invention of heat control device is one that demonstrates excellent low temperature thermal insulation property for key components or heat-sensitive elements of power equipment. The heat control device applying technical solutions described in this invention features easy manufacturing, low cost and reliable performance.