Thermal Controller with Deformable Bridge for Adaptive Heat Routing
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Solution Overview
Problem
Hardware devices face performance degradation and potential damage due to temperature fluctuations outside their operational range, as existing thermal management solutions often rely on auxiliary heating elements that consume power and fail to address high temperature operations effectively.
Innovation Solution
A thermal control system comprising a thermal node, thermal bridge, and thermally sensitive deformable body that dynamically couples and decouples with heat sinks based on environmental temperature, using a thermally sensitive deformable body to expand or contract and actuate the thermal bridge for efficient heat transfer and management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If auxiliary heating elements are used for thermal management, then low temperature operation is improved, but power consumption increases and high temperature control is not addressed
Solution Approach 1:
The system uses the device's own heat-generating components as heat sources for thermal management, eliminating the need for external heating elements. The processor or other thermally sensitive components that generate heat during operation are used to warm other components when needed, making the system self-sufficient for thermal management without additional power consumption.
Solution Approach 2:
The thermal management system serves multiple functions: it can transfer heat away from components when overheating occurs, and it can transfer heat to components when they need warmth. The same thermal bridge and heat sink infrastructure is used for both cooling and heating operations, eliminating the need for separate heating and cooling systems.
2Power
If thermal bridge is thermally coupled with both heat sinks simultaneously, then heat transfer capacity is improved, but thermal control precision deteriorates
Solution Approach 1:
The thermal bridge is designed to dynamically change its thermal coupling state with different heat sinks based on real-time temperature conditions. The system can switch between being coupled with the first heat sink, the second heat sink, or both simultaneously, allowing adaptive thermal management that maintains precision while providing sufficient heat transfer capacity when needed.
Solution Approach 2:
The system monitors temperature conditions of thermally sensitive components and uses this feedback to control the thermal bridge's coupling state. Based on the temperature feedback, the system determines whether to couple the thermal bridge with the first heat sink, second heat sink, or both, thereby maintaining precise thermal control while ensuring adequate heat transfer capacity.
3Reliability
If thermal bridge is thermally decoupled from heat sinks, then thermal damage prevention is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The system proactively prevents thermal damage by thermally decoupling the thermal bridge from heat sinks before harmful heat transfer occurs. When temperature conditions indicate potential thermal damage risk, the system preemptively disconnects the thermal bridge, preventing the harmful thermal effects before they can degrade component performance or cause failure.
Solution Approach 2:
The thermal bridge dynamically adjusts its coupling state with heat sinks based on real-time temperature conditions. The system can switch between coupled and decoupled states, allowing it to maintain high heat transfer efficiency when safe while preventing thermal damage when temperature conditions become hazardous, thereby optimizing both efficiency and safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides precise thermal control, preventing performance degradation and thermal damage by directing heat transfer appropriately, enhancing the operational efficiency and lifespan of thermally sensitive components across varying temperatures without the need for additional heating elements.
Implementation Method 1
the thermally sensitive deformable body is configured to expand or contract and actuate the thermal bridge
Implementation Method 2
cause heat transfer from the thermal node to a first heat sink by thermal coupling of the thermal bridge with the first heat sink
Data Source
AI summary
Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.