Thermal-Curable Adhesive Composition for Semiconductor Chip Peeling
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Solution Overview
Problem
Existing adhesive sheets used in semiconductor chip manufacturing face challenges with adhesion during cutting and peeling processes, leading to increased manufacturing costs and inefficiencies due to the need for additional equipment and sensitivity to environmental light, resulting in peeling transfer pollution and adhesive residue.
Innovation Solution
A thermal-curable adhesive composition with a specific rate of adhesion change, ranging from 80% to 98%, is developed, allowing for easy peeling after a heating process without additional equipment, using a base polymer with polymerizable monomers and a thermal-curable group, along with a thermal curing agent, to reduce adhesion and prevent residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If optical-curable adhesive sheets are used to reduce adhesion after cutting, then peeling property is improved, but additional equipment and processing stations are required, increasing manufacturing cost and reducing efficiency
Solution Approach 1:
The patent replaces the optical curing system (UV light equipment and processing station) with a thermal curing system that utilizes the existing heating process in semiconductor chip manufacturing. The adhesive composition contains polymerizable monomers and curing agents that react under the existing high-temperature conditions, eliminating the need for separate optical curing equipment while achieving the same adhesion control objective.
2Ease of operation
If optical-curable adhesive sheets are used to reduce adhesion after cutting, then peeling property is improved, but the adhesive sheets are sensitive to environmental light, making storage and preservation difficult
Solution Approach 1:
The patent changes the curing trigger parameter from optical (UV light sensitivity) to thermal (temperature activation). The adhesive composition is designed to remain stable under environmental light conditions while activating polymerization and curing only when exposed to the high-temperature conditions present in semiconductor chip manufacturing processes, thereby eliminating storage and preservation issues.
3Strength
If traditional adhesive sheets are heated to increase adhesion, then adhesion strength is improved, but peeling transfer pollution and adhesive residue increase on the target product
Solution Approach 1:
The patent implements dynamic adhesion control where the adhesive strength changes based on temperature conditions. During the heating process, the adhesive maintains high strength to ensure proper bonding, but after cooling, the adhesion naturally reduces due to the thermal history effect on the polymerized adhesive, enabling easy peeling without leaving residue or causing pollution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal-curable adhesive composition effectively reduces adhesion after a high-temperature heating step, enabling easy removal of the adhesive sheet from semiconductor chips while minimizing peeling transfer pollution and adhesive residue, thus enhancing manufacturing efficiency and reducing costs.
Implementation Method 1
a polymerizable monomer and a thermal-curable group
Implementation Method 2
thermal-curable adhesive composition having a rate of change of adhesion ranging from 80% to 98%... after being heated to a predetermined temperature then cooled to the room temperature
Data Source
AI summary
The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0−V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.