Thermal-Curable Inkjet Planarization Composition for High Stability
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Solution Overview
Problem
Existing UV-curable compositions for inkjet adaptive planarization require transparent superstrates, limiting material selection and resulting in substrates with low thermal stability.
Innovation Solution
A thermal curable composition comprising at least 70 wt % multi-functional vinylbenzene monomer and an azo-compound initiator, which forms a cured layer with low linear shrinkage after baking at 350° C., allowing for high thermal stability without the need for transparent superstrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If UV-curable composition is used for inkjet adaptive planarization, then the superstrate and superstrate chuck must be transparent, but this restricts material selection and results in substrates with low thermal stability
Solution Approach 1:
The patent changes the curing mechanism from UV light activation to thermal activation by selecting appropriate initiators and polymerizable materials. This parameter change eliminates the transparency requirement for superstrates, allowing use of non-transparent materials while achieving high thermal stability through the thermal curing process and subsequent baking at 350°C
Solution Approach 2:
The patent employs composite material design by combining specific polymerizable materials (including aromatic vinyl monomers and cyclic carbonate monomers) with thermal initiators to create a composition that achieves both high thermal stability and flexibility in superstrate material selection. The composite nature of the cured layer provides both optical and thermal performance characteristics
2Temperature
If thermal curable composition is used to eliminate transparent superstrate requirement, then high thermal stability is achieved, but linear shrinkage after baking must be controlled to not greater than 3.0%
Solution Approach 1:
The patent carefully selects and adjusts chemical composition parameters (monomer ratios, initiator concentrations) to control the shrinkage behavior during thermal curing and baking. By optimizing these parameters, the cured layer achieves high thermal stability while maintaining linear shrinkage within the critical 3.0% threshold, ensuring dimensional accuracy for subsequent processing
Solution Approach 2:
The patent applies different monomer compositions and ratios in specific regions or layers of the cured structure to achieve localized optimization. The use of aromatic vinyl monomers in combination with cyclic carbonate monomers creates regions with different thermal and shrinkage characteristics, allowing overall shrinkage control while maintaining high thermal stability in the bulk material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a linear shrinkage of not greater than 3.0% after baking at 350° C., providing a cured layer with exceptional thermal stability and allowing for the use of non-transparent superstrates, enhancing material selection and processing flexibility.
Implementation Method 1
the at least one initiator includes an azo-compound
Implementation Method 2
a polymerizable material and an initiator, wherein the polymerizable material may comprise at least one multi-functional vinylbenzene monomer
Implementation Method 3
a cured layer of the curable composition can have a linear shrinkage after a baking treatment at 350° C. of not greater than 3.0%
Data Source
AI summary
A curable composition can comprise a polymerizable material and an initiator, wherein the polymerizable material can comprise at least one multi-functional vinylbenzene monomer in an amount of at least 70 wt % based on the total weight of the polymerizable material; the at least one initiator includes an azo-compound; and wherein a cured layer of the curable composition has a linear shrinkage after a baking treatment at 350° C. of not greater than 3.0%.