Thermal Curing Cover Panel for Display Heat and Impact Management
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Solution Overview
Problem
As electronic devices become more functional and thinner, they are prone to breakdowns and malfunctions due to exposure to impact and excessive heat generated by highly integrated electronic components, which existing display device manufacturing methods fail to adequately address.
Innovation Solution
A display device manufacturing apparatus and method that includes a cooling unit on the front surface, a molding unit with a heating unit on the rear surface, and an injection unit to form a cover panel through thermal curing, allowing for the formation of a single-layered cover panel that dissipates heat, absorbs impact, and blocks electromagnetic waves, thereby enhancing the reliability of the display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic devices are made thinner and more highly functional, then device functionality and integration are improved, but the devices become more susceptible to impact and excessive heat generation
Solution Approach 1:
The patent applies composite materials by combining resin material with curing agents and additives to create a cover panel that integrates multiple protective functions. The composite structure includes a molding unit with heating and cooling units that transform the resin from liquid to cured solid state, creating a material that simultaneously provides heat dissipation, impact absorption, and electromagnetic shielding properties.
Solution Approach 2:
The patent implements local quality by creating a cover panel with spatially differentiated properties. The molding unit applies different temperatures (heating for curing, cooling for heat dissipation) to different regions of the resin material, resulting in a cover panel that has optimized local characteristics for protecting electronic components while maintaining overall device thinness.
2Ease of manufacture
If a cover panel is formed using conventional manufacturing methods, then the manufacturing process is simple, but the productivity and reliability improvement is insufficient
Solution Approach 1:
The patent utilizes parameter changes by transforming the physical and chemical state of the resin material through controlled temperature variations. The heating unit changes the resin from liquid to cured solid state through thermal energy, while the cooling unit subsequently removes excess heat. This parameter-based manufacturing approach enables high productivity while maintaining manufacturing feasibility.
Solution Approach 2:
The patent replaces conventional mechanical manufacturing methods with a thermal field-based system. Instead of using mechanical pressing or bonding to form the cover panel, the invention uses heating and cooling units to control the curing process and heat dissipation, substituting mechanical operations with thermal field operations that improve productivity and product quality.
3Reliability
If multiple separate protective components are used to address heat and impact protection, then protection effectiveness is improved, but device thickness and complexity increase
Solution Approach 1:
The patent merges multiple protective functions into a single integrated cover panel structure. The molding unit produces a cover panel that simultaneously provides heat dissipation, impact protection, and electromagnetic shielding, eliminating the need for separate protective components. This consolidation reduces device complexity and thickness while maintaining comprehensive protection effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases mass productivity and improves the reliability of display devices by forming a cover panel that effectively manages heat, impact, and electromagnetic interference, while maintaining the thinness and functionality of the devices.
Implementation Method 1
heating the injected resin with the heating unit to cure the injected resin
Implementation Method 2
cooling the display panel with the cooling unit
Data Source
AI summary
A display device manufacturing apparatus includes: a cooling unit disposed on a front surface of a display panel, a molding unit disposed on a rear surface of the display panel, and a heating unit disposed on the molding unit. The molding unit includes a first part facing and spaced apart from the rear surface of the display panel by a predetermined distance, and a second part bent from the first part toward the rear surface of the display panel to define an injection space together with the first part. An opening for communicating with the injection space is defined in the molding unit.