Thermal Decomposition Cores for Gouging Reduction in Multi-Patterning
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Solution Overview
Problem
Current microelectronic workpiece manufacturing processes, such as self-aligned multiple patterning (SAMP) processes, face issues with gouging during mandrel pull processes due to uneven etching of underlying layers, leading to defects like pitch-walking and processing irregularities.
Innovation Solution
The use of thermal decomposition materials as cores or gap fill materials, which can be removed through thermal treatment within specific temperature ranges (100-450°C), eliminating the need for destructive etch processes and thereby reducing gouging of underlying layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma etch processes are used for mandrel pull, then core material can be removed, but gouging occurs on exposed portions of underlying layers
Solution Approach 1:
The patent changes the removal mechanism parameter from plasma etching to thermal decomposition. By heating the substrate to temperatures between 400-1000°C, the organic core material undergoes thermal decomposition and volatilizes, eliminating the gouging effect caused by plasma etch processes while maintaining effective core removal
Solution Approach 2:
The patent replaces the plasma-based chemical etching system with a thermal decomposition system. Instead of using reactive ions to remove material, the process uses controlled heating to cause the core material to decompose and evaporate, thereby eliminating the harmful gouging effect
2Manufacturing precision
If feature size is reduced to meet physical specifications, then device performance improves, but structure integrity during patterning becomes more difficult to maintain
Solution Approach 1:
The patent changes the core material composition parameter to materials with higher thermal stability and appropriate decomposition characteristics. This allows the use of smaller feature sizes while maintaining structure integrity during the patterning process, as the thermal decomposition occurs uniformly without causing structural damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves etch uniformity and reduces defects by suppressing gouging, allowing for more precise pattern formation without the need for plasma etch processes, thus enhancing the quality of microelectronic workpieces.
Implementation Method 1
The use of thermal decomposition materials as cores or gap fill materials, which can be removed through thermal treatment within specific temperature ranges (100-450°C), eliminating the need for destructive etch processes
Data Source
AI summary
Embodiments are disclosed that reduce gouging during multi-patterning processes using thermal decomposition materials. For one embodiment, gouging is reduced or suppressed by using thermal decomposition materials as cores during multiple patterning processes. For one embodiment, gouging is reduced or suppressed by using thermal decomposition materials as a gap fill material during multiple patterning processes. By using thermal decomposition material, gouging of an underlying layer, such as a hard mask layer, can be reduced or suppressed for patterned structures being formed using the self-aligned multi-patterning processes because more destructive etch processes, such as plasma etch processes, are not required to remove the thermal decomposition materials.