Thermal Detector Probe for Capacitive Contact
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Solution Overview
Problem
Existing methods for measuring electrical properties of test samples, such as semiconductor wafers, face challenges including large probe footprints leading to contamination and limited applicability on non-conducting surfaces, and require precise contact control to establish stable ohmic connections.
Innovation Solution
A micro cantilever multi-point probe system with a thermal detector that uses a thermal detector to measure proximity to the test sample by adjusting its distance and establishing capacitive contact, allowing for precise electrical property testing while minimizing contamination and accommodating non-conducting surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a strain gauge detector is used for landing control, then the probe can detect contact with the test sample, but the total footprint increases and sample contamination increases
Solution Approach 1:
The patent replaces the mechanical strain gauge detection system with a thermal detection system. The thermal detector measures temperature changes caused by capacitive coupling between the probe and test sample, eliminating the need for additional mechanical contact sensors and reducing the probe footprint, thereby minimizing sample contamination.
2Area of stationary object
If electrical contact detection is used, then the probe footprint is reduced, but it cannot work on non-conducting surfaces
Solution Approach 1:
The patent changes the detection parameter from electrical conductivity to thermal response. The thermal detector measures temperature changes resulting from capacitive coupling, which occurs on all surfaces regardless of electrical conductivity. This enables the probe to work on both conducting and non-conducting surfaces while maintaining a small footprint.
3Measurement precision
If the probe approaches closer to establish ohmic contact, then electrical property measurement accuracy improves, but the risk of probe breakage and contamination increases
Solution Approach 1:
The patent performs preliminary thermal detection to assess the proximity and capacitive coupling before establishing full ohmic contact. This allows the system to approach the test sample carefully, using thermal feedback to guide the contact process and prevent sudden impacts that could break the probe or contaminate the sample, while still achieving accurate measurements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves precise and contamination-minimized electrical property measurements by using thermal detection to control probe proximity and establish capacitive contact, enhancing measurement accuracy and applicability across various surface types.
Implementation Method 1
establishing capacitive contact
Implementation Method 2
thermal detector to measure proximity
Data Source
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AI summary
A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe comprises a probe body, a first cantilever extending from the probe body, and a first thermal detector extending from the probe body. The thermal detector is used to position the cantilever with respect to a test sample.