Thermal Diffusion Member for Display Hot Spot Management
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Solution Overview
Problem
High refresh rates, luminance, and resolution in electronic device displays lead to increased heat generation, potentially causing hot spots that can malfunction electronic devices.
Innovation Solution
Incorporating a thermal diffusion member between the circuit board and the display panel, specifically in areas where display driver ICs and timing controller ICs overlap, to efficiently transfer and dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If display performance is increased (high refresh rate, high luminance, high resolution), then display quality is improved, but heat generation increases causing hot spots
Solution Approach 1:
A thermal diffusion member is introduced as an intermediary component between the display panel and the circuit board. This thermal diffusion member includes a thermal diffusion layer and a thermal blocking layer, acting as a mediator to redirect heat flow away from hot spots while preserving display performance.
Solution Approach 2:
The patent changes the thermal parameters of the structure by introducing a thermal diffusion member with specific thermal conductivity characteristics. The thermal diffusion layer has high thermal conductivity to spread heat, while the thermal blocking layer has low thermal conductivity to prevent heat from reaching sensitive areas, thereby controlling temperature distribution.
2Temperature
If thermal diffusion member is added to reduce hot spots, then temperature control is improved, but device structure becomes more complex
Solution Approach 1:
The thermal diffusion member combines multiple functions into a single component: heat diffusion, heat blocking, and structural support. By merging these functions into one integrated component rather than separate elements, the design reduces overall structural complexity while achieving effective temperature control.
Solution Approach 2:
The thermal diffusion member serves multiple purposes simultaneously: it acts as a thermal management component to reduce hot spots, provides structural support between the display panel and circuit board, and enables flexible arrangement of electronic components. This multi-functionality reduces the need for additional separate components.
3Temperature
If thermal diffusion member is disposed between circuit board and display panel, then heat dissipation is improved, but manufacturing process becomes more difficult
Solution Approach 1:
The thermal diffusion member is constructed as a thin-film structure that can be flexibly formed and integrated into the display assembly. This thin-film approach simplifies manufacturing compared to bulk thermal management components, allowing for easier integration into existing display manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of a thermal diffusion member effectively reduces hot spots, preventing malfunctions and extending the lifespan of electronic device components.
Implementation Method 1
a thermal diffusion member disposed between the circuit board and the display panel, and disposed in an area in which at least some of the plurality of DDICs and the timing controller IC overlap each other
Data Source
AI summary
An electronic device including a thermal diffusion member for reducing hot spots is provided. The electronic device includes a plurality of display driver integrated circuits (DDICs) spaced apart from each other in a non-display area of a display panel, and disposed oriented in a first direction from the display panel, a circuit board disposed in a second direction opposite to the first direction from the display panel, and including a timing controller IC (T-CON IC) disposed so as to overlap at least some of the plurality of DDICs when the display panel is viewed from the first direction, a flexible circuit board disposed at one end of the display panel, and electrically connecting the plurality of DDICs and the circuit board, and a thermal diffusion member disposed, between the circuit board and the display panel.