Thermal Diffusion Member Layout for Thin Electronic Devices
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Solution Overview
Problem
The miniaturization of electronic devices has led to insufficient thermal diffusion performance due to the limited thickness of thermal diffusion members, necessitating improved thermal management structures.
Innovation Solution
The electronic device incorporates a thermal diffusion member with a first diffusion portion extending along the length direction and a second diffusion portion extending along the width direction, integrated into the housing with support portions to enhance heat dissipation, including a vapor chamber and heat pipes for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the thermal diffusion member is reduced to accommodate miniaturization, then the device size is reduced, but the thermal diffusion performance deteriorates
Solution Approach 1:
The thermal diffusion member is configured with multiple diffusion portions extending in different directions (first diffusion portion along length direction, second diffusion portion along width direction) to transform thermal diffusion from a single-dimensional thickness-dependent process to a multi-dimensional spatial distribution, effectively compensating for reduced thickness while maintaining superior heat dissipation performance
2Device complexity
If a single thermal diffusion member is used, then the device complexity is reduced, but the thermal diffusion coverage is insufficient
Solution Approach 1:
The thermal diffusion member is segmented into multiple functional portions (first diffusion portion overlapping with printed circuit board, second diffusion portion overlapping with battery, third diffusion portion connecting both) that are integrated into a single component. This segmentation enables targeted heat diffusion to different heat-generating components while maintaining structural simplicity and avoiding the need for multiple separate thermal management devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves thermal diffusion performance by effectively dissipating heat generated by the printed circuit board to other areas of the device, maintaining optimal operating temperatures despite compact designs.
Implementation Method 1
a thermal diffusion member disposed between the printed circuit board and the display and between the battery and the display
Implementation Method 2
including a vapor chamber and heat pipes for efficient heat transfer
Implementation Method 3
including a vapor chamber and heat pipes for efficient heat transfer
Data Source
AI summary
An electronic device includes: a housing; a display disposed on one surface of the housing; a printed circuit board disposed in an interior of the housing; a battery disposed in one direction of the printed circuit board in the interior of the housing, the battery includes a first portion and a second portion located at an end facing the printed circuit board; and a thermal diffusion member between the printed circuit board and the display and between the battery and the display. The thermal diffusion member includes a first diffusion portion which at least a portion of overlaps with the printed circuit board and at least a portion extends in the first portion of the battery, and a second diffusion portion between the second portion of the battery and the first diffusion portion and extended to be overlapped with at least a portion of the second portion of the battery.