Electronic Apparatus Thermal Diffusion Plate Air Guide Passage
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Solution Overview
Problem
Existing electronic apparatuses with heating elements, such as CPUs, face inefficiencies in heat dissipation due to excessive temperature buildup, leading to reduced operational performance or inoperability, despite the use of air-cooled cooling devices with heat sinks and fans, which can be cumbersome and require additional components like heat pipes.
Innovation Solution
An electronic apparatus design featuring elastically-deformable thermal diffusion plates thermally connected to the CPU and gate array, a centrifugal fan, and an air guide passage formed by a partition member, allowing direct airflow to the thermal diffusion plates for efficient heat dissipation without the need for dedicated heat pipes, thereby reducing component count and enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional air-cooled cooling device with heat sink and fan is used, then heat dissipation performance is improved, but device complexity increases due to additional components like heat pipes
Solution Approach 1:
The patent merges the heat dissipation function directly into the casing structure by forming the air guide passage and partition members as integral parts of the casing, eliminating the need for separate heat pipes and reducing overall component count while maintaining effective heat transfer from CPU to ambient air
2Temperature
If multiple cooling components are integrated into the casing, then cooling efficiency is improved, but the casing occupies more volume
Solution Approach 1:
The casing is designed to serve multiple functions simultaneously: it provides structural enclosure, forms the air guide passage for cooling airflow, incorporates partition members for airflow direction control, and acts as a heat dissipation structure, thereby achieving effective cooling without increasing overall device volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of the CPU and gate array, preventing internal temperature increases, reducing the number of components needed, and allowing for cost, weight, and design miniaturization benefits, while maintaining flexibility in design modifications.
Implementation Method 1
elastically-deformable partition member interposed between the circuit board and the bottom portion... thermally connected to the CPU
Implementation Method 2
a fan having an air take-in port through which air in the first area is taken in
Data Source
AI summary
According to one embodiment, an electronic apparatus includes: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-deformable partition member interposed between the circuit board and the bottom portion and surrounding the first area; and a fan having an air take-in port through which air in the first area is taken in.