Thermal Diffusion Substrate Layout for High-Current Heat Dissipation
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Solution Overview
Problem
Existing substrates face challenges in efficiently dissipating heat generated by electronic components, particularly those with high current flow, and there is a need for improved heat dissipation structures.
Innovation Solution
The substrate design incorporates a thermal diffusion circuit with a first base and a second base extending beyond the first base in the planar direction, utilizing a temperature difference to dissipate heat, and includes an insulator to prevent electrical conduction, with optional integration of an electric circuit for additional heat dissipation and support members for rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a columnar copper inlay is disposed immediately below an electronic component in a through-hole to dissipate heat, then heat dissipation is achieved, but the heat dissipation efficiency is insufficient for high current flow components
Solution Approach 1:
The invention transitions from a simple columnar inlay to a multi-layer base structure (first base and second base) where the second base extends beyond the first base in planar direction. This dimensional expansion creates a larger heat dissipation area and improves thermal diffusion efficiency, resolving the insufficient heat dissipation capacity for high current components.
Solution Approach 2:
The thermal diffusion circuit is divided into functionally distinct segments: the first base positioned at the electronic component side for heat reception, and the second base extending outward for enhanced heat dissipation. This segmentation allows each portion to optimize its specific function, improving overall heat dissipation efficiency.
2Temperature
If the second base extends beyond the first base in planar direction to improve heat dissipation, then heat dissipation efficiency is improved, but electrical insulation requirements increase
Solution Approach 1:
An insulator is introduced as an intermediary element positioned between the thermal diffusion circuit and the electronic component. This insulator prevents electrical conduction while allowing thermal diffusion, resolving the conflict between extended base structure for heat dissipation and electrical insulation requirements.
Solution Approach 2:
The system is segmented into distinct functional layers: the insulator layer handles electrical isolation, while the extended base structure handles thermal diffusion. This functional segmentation allows each component to optimize its specific role without compromising the other.
3Reliability
If an insulator is disposed on the upper side of the first base to prevent electrical conduction, then electrical insulation is achieved, but heat dissipation path is obstructed
Solution Approach 1:
The insulator serves as a thermal intermediary that allows heat diffusion while blocking electrical conduction. By selecting appropriate insulator materials with good thermal conductivity but electrical insulation properties, both electrical safety and heat dissipation are maintained.
Solution Approach 2:
The insulator is strategically positioned only where electrical insulation is needed (between the thermal diffusion circuit and electronic component), while the extended second base provides uninterrupted heat dissipation pathways in other regions. This localized application maintains heat dissipation efficiency while providing necessary electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated by electronic components while preventing electrical short circuits, enhancing heat dissipation efficiency and maintaining structural integrity.
Implementation Method 1
a thermal diffusion circuit 2 configured to cause heat to flow by using a temperature difference
Data Source
Figure 1
Figure 2(A)~2(C)
Figure 3(A)~3(C)
AI summary
[Problem] To provide a substrate that efficiently dissipates heat of an electronic component mounted on the substrate. [Solution] This substrate is characterized by comprising a thermal diffusion circuit in which heat is caused to flow by means of a temperature difference, and an insulator, wherein: the thermal diffusion circuit includes a first base and a second base, the first base and the second base constituting an integral structure without a connecting surface; the first base is disposed on the side (upper side) on which an electronic component is disposed; the second base is disposed on the opposite side (lower side) from the side on which the electronic component is disposed; the second base is structured to extend beyond the first base in a planar direction; and the insulator is disposed on the side (upper side) of the first base where the electronic component is disposed.