Thermal Diffusivity Measurement for Miniaturized Heat Pipes
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Solution Overview
Problem
Current methods lack a reliable way to predict instantaneous temperature changes in miniaturized electronic devices, which is crucial for effective heat dissipation as heating density increases and traditional heat sinks become unsuitable for smaller devices.
Innovation Solution
A thermal diffusivity performance measurement system that uses a heater, temperature sensor, and calculation unit to measure and calculate the ratio of heat conduction to convection intensity and dimensionless time, employing a specific equation to establish a temperature predictive model for heat pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional stacked heat sinks are used for heat dissipation, then heat dissipation performance is improved, but device size becomes too large for miniaturized electronic equipment
Solution Approach 1:
The patent utilizes phase change materials (paraffin) that transition from solid to liquid state during heat absorption, enabling high-density energy storage in a compact volume. This phase transition mechanism allows the heat dissipation system to achieve superior thermal management performance while maintaining miniaturized dimensions suitable for portable electronic devices.
2Measurement precision
If long time measurement is used to measure instantaneous and steady-state temperature, then measurement accuracy is improved, but measurement time is excessive and prediction capability is lost
Solution Approach 1:
The patent employs preliminary thermal testing to establish empirical relationships between temperature evolution and thermal diffusivity parameters. By conducting preliminary experiments to build predictive models, the system can then rapidly predict temperature behavior without requiring lengthy real-time measurements, thus achieving both accuracy and speed.
Solution Approach 2:
The patent creates a thermal prediction model that replicates the thermal behavior of the heat dissipation system. This virtual copy allows for rapid temperature prediction at any time point without physical measurement, effectively copying the thermal response characteristics to enable fast prediction while maintaining measurement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate prediction of heat pipe performance with a prediction accuracy of 99.7% and a simple, fast method to measure thermal diffusivity, suitable for miniaturized electronics, reducing prediction error to within 7%.
Implementation Method 1
The heater is to heat the pillar
Implementation Method 2
The temperature sensor is disposed at the heat pipe and used to measure the temperature of the pillar
Implementation Method 3
calculate a ratio of heat conduction to convection intensity
Implementation Method 4
calculate a ratio of heat conduction to convection intensity
Data Source
AI summary
A thermal diffusivity performance measurement system is configured to measure a temperature of a pillar. The thermal diffusivity performance measurement system has a temperature sensor and a calculation unit. The temperature sensor is disposed at the pillar and configured to measure the temperature of the pillar. The calculation unit is configured to calculate a ratio of heat conduction to convection intensity per unit conduction intensity and a dimensionless time based on the measuring results of the temperature sensor. The calculation unit is configured to introduce the ratio of the heat conduction to the convection intensity per unit conduction intensity and the dimensionless time into a first formula as following:θ(X,τ)=cosh(M-MX)sech(M)+∑n=1N-2λnM2+λn2sin(λnX)e-(M2+λn2)τThe calculation unit calculates a temperature predictive model after the first formula is solved.