Self-Regulating Thermal Diode for Bidirectional Heat Control

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Solution Overview

Problem

Existing thermal diodes are limited in their ability to control heat transfer in both directions, leading to overheating issues when the second side becomes hotter than the first side.

Innovation Solution

A self-regulating thermal diode is designed with a negative coefficient of thermal expansion layer and a positive coefficient of thermal expansion layer, allowing it to transition between connected and disconnected states based on temperature variations, thereby controlling heat flow in both directions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermal diode is used to permit heat flow in one direction, then heat transfer efficiency is improved, but overheating occurs on the second side when it becomes hotter than the first side

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidoverheating
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The thermal diode transitions between connected and disconnected states dynamically based on temperature conditions. When the second side becomes hotter than the first side, the thermal diode automatically disconnects to prevent heat flow in the reverse direction, thereby preventing overheating while maintaining heat transfer efficiency under normal operating conditions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The thermal diode changes its thermal conductivity parameter based on temperature differential. It exhibits high thermal conductivity when heat flows from the first side to the second side, and low thermal conductivity when heat flow attempts to reverse direction, thus resolving the contradiction between efficient heat transfer and overheating prevention.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If a thermal diode blocks heat flow in reverse direction, then overheating is prevented, but heat flow control in both directions is limited

Engineering Contradiction:
Improveoverheating preventionVSAvoidheat flow control capability
Core Design Contradiction:
Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The thermal diode system dynamically adjusts its state between connected and disconnected based on real-time temperature conditions of both sides. This enables bidirectional heat flow control capability - allowing heat flow when the first side is hotter, and blocking heat flow when the second side is hotter, thereby achieving both overheating prevention and versatile heat flow control.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermal diode effectively prevents overheating by allowing heat to flow only when necessary, ensuring efficient heat management between components.

Implementation Method 1

The thermal diode includes a negative coefficient of thermal expansion layer that defines an inner side and outer side

Methodology Applied
Scientific EffectNegative coefficient of thermal expansion: Negative Thermal Expansion

Implementation Method 2

The thermal diode also includes a positive coefficient of thermal expansion layer that defines an inner side and an outer side

Methodology Applied
Scientific EffectPositive coefficient of thermal expansion: Thermal Expansion

Implementation Method 3

allowing a flow of energy between the first and second components

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12328848B2Systems and methods for controlling heat transfer between components
Publication Date: 2025.06.10 BATTELLE SAVANNAH RIVER ALLIANCE LLC
  • US12328848B2 patent drawing
  • US12328848B2 patent drawing
  • US12328848B2 patent drawing

AI summary

A system for controlling heat transfer between components. The system includes a first component and a second component spaced apart from the first component. The system also includes a thermal diode positioned between the first and second components. The thermal diode includes a negative coefficient of thermal expansion layer and a positive coefficient of thermal expansion layer. The thermal diode is configured to transition between a connected state and a disconnected state. The thermal diode is configured to transition back-and-forth between the connected and disconnected states with variations in at least one of a first temperature of the first component or a second temperature of the second component.