Thermal Dispersion Pattern in Semiconductor Memory Device
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Solution Overview
Problem
The increasing demand for application processors in small mobile devices leads to heat generation issues, particularly with components like GPUs, which can cause operation failures and device shutdown due to hot spots, as existing technologies fail to effectively manage thermal dispersion within semiconductor memory devices.
Innovation Solution
A semiconductor memory device with an integrated circuit (IC) chip structure that includes a substrate, memory cells, a local well with a different conductivity type, a wiring stack structure with both signal and thermal dispersion patterns, and a heat transfer structure to dissipate heat from hot spots to a thermal dispersion pattern, which is then dissipated using a heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional chips are added to the logic chip to increase functionality, then the performance and task capability are improved, but the heat generation increases causing hot spots and operation failures
Solution Approach 1:
The patent divides the chip structure into functionally independent units (logic chip, memory device, GPU) that can be selectively activated. By segmenting the processing tasks across different chips, the system can distribute heat generation and activate only the necessary components for each task, reducing overall thermal accumulation while maintaining versatility.
Solution Approach 2:
The patent introduces a vertical stacking architecture where multiple chips are arranged in three-dimensional space. This dimensional change allows heat to be dissipated in multiple directions (through thermal dispersion patterns extending vertically and laterally) rather than being confined to a planar arrangement, effectively managing heat generation while maintaining high functionality.
2Power
If the GPU operates at high performance, then the graphics processing capability is improved, but excessive heat is generated causing operation failures and device shutdown
Solution Approach 1:
The patent introduces thermal dispersion patterns as intermediary structures between the GPU heat source and the surrounding environment. These patterns act as thermal mediators that gradually distribute and dissipate heat from the high-power GPU, preventing sudden thermal spikes that would cause operation failures while maintaining graphics processing performance.
Solution Approach 2:
The thermal dispersion patterns are pre-configured into the chip structure before operation. This preliminary thermal management infrastructure is ready to immediately dissipate heat when the GPU operates at high power, preventing thermal runaway and maintaining operation stability without requiring real-time thermal response adjustments.
3Temperature
If thermal dispersion structures are added to manage heat, then the temperature control is improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the thermal dispersion patterns with the existing wiring stack structure and signal transfer patterns. By combining thermal management functions with the existing interconnect architecture, the patent achieves effective heat dissipation without adding completely separate thermal management components, thereby reducing the increase in device complexity.
Solution Approach 2:
The patent designs the wiring stack structure to serve dual purposes: electrical signal transmission and thermal conduction. The same metal interconnect layers that carry signals also function as thermal dispersion pathways, eliminating the need for dedicated thermal management structures and reducing overall device complexity while maintaining effective temperature control.
4Temperature
If separate thermal management structures are added, then the heat dissipation is improved, but the manufacturing process requires additional steps increasing complexity
Solution Approach 1:
The thermal dispersion patterns are formed using the same manufacturing processes as the wiring structures, specifically utilizing the metal deposition and patterning steps already required for creating signal interconnects. This merging of thermal and electrical structure fabrication eliminates the need for separate thermal management manufacturing steps, maintaining ease of production while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively disperses and dissipates heat from hot spots within the semiconductor memory device and when combined with other devices, preventing thermal damage and ensuring reliable operation by integrating thermal dispersion with signal transfer processes without additional manufacturing steps.
Implementation Method 1
a heat transfer structure connected to the thermal dispersion pattern for transferring heat to the thermal dispersion pattern from a heat source
Implementation Method 2
a thermal dispersion pattern connected to the local well through a thermal interconnector
Data Source
AI summary
A semiconductor memory device includes an integrated circuit (IC) chip structure, wherein the IC chip includes a substrate, a memory cell disposed on the substrate, and a local well disposed on the substrate, wherein a conductivity type of the local well is different from a conductivity type of the substrate, a wiring stack structure disposed on the IC chip structure, wherein the wiring stack structure includes a signal transfer pattern connected to the memory cell through a signal interconnector, and a thermal dispersion pattern connected to the local well through a thermal interconnector, and a heat transfer structure connected to the thermal dispersion pattern for transferring heat to the thermal dispersion pattern from a heat source.