Thermal Dissipation Blocks for High-Density Semiconductor Packaging
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Solution Overview
Problem
The increasing miniaturization and functional integration of semiconductor dies pose challenges in packaging, leading to difficulties in efficiently dissipating heat and maintaining yield.
Innovation Solution
The implementation of thermal dissipation blocks with higher metal density, distributed across multiple layers and interconnected via, to effectively manage heat dissipation in semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor dies are miniaturized and more functions are integrated, then functional capability increases, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces thermal dissipation blocks that extend vertically across multiple packaging layers (first layer, second layer, third layer), transforming heat dissipation from a two-dimensional surface issue to a three-dimensional volumetric solution. The blocks span through the packaging structure to reach heat sinks or cooling mechanisms, enabling efficient heat removal from densely integrated dies without increasing die area.
Solution Approach 2:
The thermal dissipation blocks are constructed from materials with high thermal conductivity, potentially composite materials combining metal matrices with thermally conductive particles or phases. These composite structures provide enhanced heat transfer pathways while maintaining mechanical integrity within the packaging assembly, addressing the heat dissipation challenge without compromising structural requirements.
2Adaptability or versatility
If I/O pad density increases to accommodate more functions, then device capability improves, but packaging difficulty increases
Solution Approach 1:
The patent divides the packaging structure into multiple hierarchical layers (first packaging layer, second packaging layer, third packaging layer) with redistribution networks at each level. This segmentation allows I/O pads to be distributed across multiple planes and locations, effectively increasing the functional I/O capacity without concentrating all connections on a single crowded die surface, thereby simplifying the packaging process.
Solution Approach 2:
The packaging structure employs a nested arrangement where multiple packaging layers are stacked vertically, with each layer containing redistribution networks that connect to dies below. This nested configuration enables I/O pads to be accessed from multiple levels, effectively multiplying the available connection points without increasing the lateral footprint, thus reducing packaging complexity despite high I/O requirements.
3Temperature
If thermal dissipation blocks with high metal density are implemented, then thermal conductivity improves, but manufacturing complexity increases
Solution Approach 1:
The thermal dissipation blocks serve multiple functions simultaneously: they provide thermal conduction pathways, act as structural support elements within the packaging layers, and serve as mounting substrates for heat sinks or thermal interface materials. This multi-functionality reduces the need for separate dedicated thermal management components, simplifying the overall manufacturing process despite the high metal density requirements.
Solution Approach 2:
The patent merges the thermal dissipation function with the structural packaging framework by integrating thermal blocks into the inter-layer connectivity structure. Rather than adding separate thermal management components, the thermal pathways are combined with the mechanical support and electrical interconnection structures, reducing the total number of manufacturing steps and assembly operations required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal conductivity, significantly reducing the temperature of heat-generating package components, thereby improving packaging efficiency and yield.
Implementation Method 1
the thermal dissipation block may include a higher metal density than the regions including redistribution lines
Data Source
AI summary
A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.