Thermal Distribution Network for Semiconductor Stacked Dies
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Solution Overview
Problem
The challenge in stacked semiconductor devices is effectively managing heat dissipation across multiple dies to prevent overheating, which limits performance and capacity due to thermal interference between components.
Innovation Solution
A thermal distribution network is implemented, using thermally conductive components and adhesive materials to create separate thermal pathways from each die to the package substrate, ensuring heat from one die does not interfere with others, allowing for efficient heat dispersal and isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor dies are stacked vertically to increase capacity and performance, then the device density and capacity are improved, but thermal interference between components increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the thermal management system into separate thermal pathways for each die. Each die has its own dedicated thermal pathway that extends laterally to the package substrate, preventing heat from one die from transferring to adjacent dies. This segmentation of thermal paths resolves the contradiction by maintaining high device density while eliminating thermal interference between stacked components.
Solution Approach 2:
The patent transitions from vertical heat dissipation (constrained by the stacked configuration) to lateral heat dissipation. Thermal pathways extend horizontally from each die to the package substrate, utilizing the lateral dimension for heat removal. This dimensional change allows heat to be dissipated away from the stack, reducing thermal interference while maintaining the vertical stacking for high capacity.
2Quantity of substance
If multiple semiconductor dies are stacked vertically to increase capacity and performance, then the device density is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
Each die is assigned a dedicated thermal pathway that is thermally isolated from other dies. This segmentation ensures that heat generated by each die can be independently dissipated through its own pathway to the package substrate, preventing thermal congestion and maintaining efficient heat dissipation despite high device density.
Solution Approach 2:
The patent introduces thermal pathways as intermediary structures between the dies and the package substrate. These pathways act as dedicated heat transfer mediators that conduct heat laterally from each die to the substrate, improving heat dissipation efficiency by providing optimized thermal conduction paths separate from the electrical interconnects.
3Productivity
If multiple semiconductor dies are stacked vertically to increase capacity, then the performance is improved, but thermal management complexity increases
Solution Approach 1:
The patent merges the thermal management function with the existing package substrate structure. Thermal pathways are integrated into the substrate, utilizing its thermal mass and structure for heat dissipation. This merging approach simplifies thermal management by combining multiple functions (structural support, electrical interconnection, and thermal dissipation) into a unified package design rather than adding separate complex cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation, preventing thermal interference and ensuring that each die operates within optimal temperature ranges, thereby enhancing the performance and capacity of stacked semiconductor devices.
Implementation Method 1
A thermal distribution network establishes one or more thermal pathways from the first die to the package substrate
Implementation Method 2
Each of the one or more second dies are thermally insulated from the thermal distribution network and the first die
Data Source
AI summary
Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments the semiconductor devices include a package substrate, a controller die carried by the package substrate and a spacer carried by the package substrate spaced apart from the controller die. A thermally conductive material can be carried by an upper surface of the controller die and establish a thermal path extending from the upper surface of the controller die to the package substrate. The thermal path can reach the package substrate at a position horizontally between the controller die and the spacer. The semiconductor device can also include one or more dies at least partially carried by the spacer and at least partially above the controller die and the thermally conductive material. Each of the one or more dies is thermally insulated from the thermally conductive material, for example by a thermal adhesive layer between the two.