Direct Thermal Electric Conversion via Recombination Heterojunctions
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Solution Overview
Problem
Existing technologies face challenges in efficiently converting available heat energy into electrical power, often considering waste heat as a byproduct that needs to be dissipated, rather than harnessed for energy generation.
Innovation Solution
The development of direct thermal electric conversion systems using semiconductor materials with alternating layers of low and high recombination materials, where heat energy drives the migration of charge carriers across heterojunctions, generating electrical power through the movement of electrons and holes, allowing for the capture of 'built-in' potential and conversion into direct or alternating current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat is dissipated into the atmosphere using cooling towers, then thermal management is achieved, but energy is lost and thermal efficiency deteriorates
Solution Approach 1:
The patent converts waste heat, previously considered a harmful byproduct requiring dissipation, into a beneficial energy source for electrical power generation. The semiconductor device directly converts thermal energy from waste heat into electrical energy, transforming the harmful heat loss into useful power output, thereby improving overall thermal efficiency and reducing energy waste.
Solution Approach 2:
The patent replaces complex mechanical heat-to-power conversion systems (such as steam turbines requiring boilers, turbines, and condensers) with a direct semiconductor-based thermoelectric conversion device. This substitution eliminates mechanical moving parts and complex thermal cycles, achieving direct conversion of heat to electricity through semiconductor heterostructures with different recombination rates.
2Power
If steam turbines are used to generate power from heat, then electrical power is generated, but system complexity increases
Solution Approach 1:
The patent extracts and eliminates the complex mechanical intermediate components (steam generators, turbines, condensers, pumps) from the heat-to-power conversion system. By using direct semiconductor thermoelectric conversion, the system reduces to a compact solid-state device that directly converts thermal energy to electrical energy without mechanical intermediaries, significantly reducing system complexity while maintaining power generation capability.
Solution Approach 2:
The patent replaces the entire mechanical steam turbine system with a solid-state semiconductor device. The complex mechanical system involving phase changes, moving parts, and thermal cycles is substituted with a static semiconductor structure that directly converts heat to electricity through carrier migration across heterojunctions, eliminating mechanical complexity.
3Use of energy by moving object
If secondary fluids are used to convert heat to power, then energy conversion is achieved, but additional components and systems are required
Solution Approach 1:
The patent extracts and eliminates the secondary fluid medium from the energy conversion process. Instead of using steam or other fluids as intermediaries, the invention uses solid semiconductor materials that directly convert thermal energy to electrical energy through carrier migration, removing the need for fluid circulation systems, heat exchangers, and associated components.
Solution Approach 2:
The patent replaces fluid-based thermal energy conversion with solid-state semiconductor conversion. The secondary fluid system requiring pumps, pipes, and heat exchangers is substituted with a solid semiconductor device where heat directly generates electrical carriers within the material structure, eliminating the need for additional components and systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These systems effectively convert heat into electrical power, improving thermal efficiency and reducing system complexity by enabling the utilization of waste heat as a viable energy source, with demonstrated performance in semiconductor embodiments showing measurable voltage and current outputs across varying temperatures.
Implementation Method 1
heat energy drives the migration of charge carriers across heterojunctions, generating electrical power through the movement of electrons and holes
Implementation Method 2
heat energy drives the migration of charge carriers across heterojunctions, generating electrical power through the movement of electrons and holes
Data Source
AI summary
Systems and methods are operable to generate electric power from heat. Embodiments employ one or more direct thermal electric converters that have at least a first recombination material having a first recombination rate, a second recombination material adjacent to the first recombination material and having a second recombination rate, wherein the second recombination rate is different from the first recombination rate, and a third recombination material adjacent to the second recombination material and having a third recombination rate substantially the same as the first recombination rate. Application of heat generates at least first charge carriers that migrate between the first recombination material and the second recombination material, and generates at least second charge carriers that migrate between the third recombination material and the second recombination material. The migration of the first charge carriers and the migration of the second charge carriers generates an electrical current.