Thermal Conducting Element Layout for Dense Electronic Packaging
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Solution Overview
Problem
Conventional electronic devices face poor heat dissipation efficiency due to a small heat dissipation area, which is exacerbated by the miniaturization and high density of electronic elements.
Innovation Solution
The electronic device incorporates a thermal conducting element disposed between the circuit layer and the electronic element, as well as a flow-path structure with a fluid material, to enhance heat exchange and improve heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging technology with bumps or contacts is used to achieve electrical connection, then electrical connection is achieved, but heat dissipation area is small resulting in poor heat dissipation efficiency
Solution Approach 1:
The patent makes the connectors serve dual functions: electrical connection and heat dissipation. By designing connectors with thermal conductive properties (using materials like copper, aluminum, or thermal conductive polymers with conductivity ≥0.4 W/m·K), the same structural elements that provide electrical connectivity also function as heat dissipation pathways, eliminating the need for separate thermal management components.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single integrated system. The connectors are designed to simultaneously conduct electricity and heat, combining two previously separate functions into one component, thereby increasing heat dissipation area without adding separate thermal management structures.
2Productivity
If miniaturization and high density of electronic elements are implemented, then device integration is improved, but heat dissipation area is reduced resulting in poor heat dissipation efficiency
Solution Approach 1:
The patent enables connectors to perform dual functions of electrical connection and heat dissipation. By using thermal conductive materials in the connectors (such as copper, aluminum, or thermal conductive polymers), the same components that provide electrical connectivity in miniaturized devices also serve as heat dissipation pathways, allowing high device integration without sacrificing thermal management capability.
3Temperature
If heat dissipation area is increased using thermal conducting element and flow-path structure, then heat dissipation efficiency is improved, but device complexity is increased
Solution Approach 1:
The patent makes connectors serve dual purposes as both electrical connection elements and heat dissipation structures. By designing connectors with thermal conductive properties, the same components provide both electrical and thermal functions, increasing heat dissipation area without adding separate thermal management components or complex additional structures.
Solution Approach 2:
The patent combines electrical connection and heat dissipation functions into the same connectors. This integration allows the system to achieve enhanced heat dissipation through existing connector structures rather than adding separate thermal management components, thereby improving heat dissipation efficiency while minimizing increases in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution significantly improves heat transfer and dissipation efficiency by increasing the heat exchange area and utilizing thermal conductive materials and fluid-based heat exchange methods.
Implementation Method 1
The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.
Implementation Method 2
The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element.
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.