Thermal Elements in Adhesive Joints for Disassembly
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Solution Overview
Problem
The challenge in disassembling adhesively bonded structures, particularly those produced through additive manufacturing, lies in the inefficiency and labor-intensiveness of current methods, which often require machining to remove striations and achieve a smooth surface finish, introducing substantial inefficiencies and inefficiencies into the manufacturing process.
Innovation Solution
Incorporating thermal elements within the adhesive joints of additively manufactured components, which can be activated by thermal or electrical energy to weaken the adhesive, allowing for disassembly without machining, thereby reducing thermal input and enhancing serviceability and reducing scrap during servicing and repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If machining is used to remove striations and achieve smooth surface finish, then surface quality is improved, but manufacturing efficiency deteriorates due to substantial time loss and labor intensity
Solution Approach 1:
The patent embeds thermal elements within the adhesive joints during the additive manufacturing process itself, before the component is completed. These thermal elements are pre-positioned to enable future disassembly without machining, thereby eliminating the need for post-manufacturing surface finishing operations while maintaining manufacturing efficiency.
Solution Approach 2:
The patent replaces the mechanical machining process with a thermal field approach. By embedding thermal elements that generate heat locally within the adhesive joint, the solid adhesive can be softened thermally, allowing for easy separation without mechanical removal. This substitutes a high-efficiency thermal process for an inefficient mechanical machining operation.
2Productivity
If adhesive bonding is used to join components, then assembly efficiency is improved, but disassembly capability deteriorates due to permanent bonding
Solution Approach 1:
The patent changes the physical state of the adhesive from solid to softened state through localized heating. By embedding thermal elements within the adhesive joint, the adhesive's temperature and viscosity can be temporarily altered, transforming the permanent bond into a reversible connection that allows for easy disassembly while maintaining strong bonding during normal operation.
Solution Approach 2:
The thermal elements embedded within the adhesive joint act as intermediaries that mediate between the bonded components. These elements remain dormant during normal operation but can be activated to facilitate disassembly by generating heat that softens the adhesive, thereby enabling repair and reconfiguration without damaging the components.
3Productivity
If thermal elements are embedded in adhesive joints, then disassembly efficiency is improved, but device complexity increases due to additional components
Solution Approach 1:
The patent merges the thermal element with the adhesive joint itself, embedding the thermal functionality directly within the bonding material. This integration eliminates the need for separate external heating systems or additional structural components, thereby improving disassembly efficiency while minimizing increases in device complexity.
Solution Approach 2:
The adhesive joint serves multiple functions: it provides structural bonding during normal operation and acts as a housing for the thermal element that enables future disassembly. This multi-functionality reduces the need for separate dedicated disassembly mechanisms, thereby improving efficiency without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient disassembly of adhesively bonded structures without damaging the components, reducing thermal impact, and allowing for the reuse of undamaged parts, thereby improving the serviceability and reducing the overall manufacturing inefficiencies.
Implementation Method 1
at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element
Data Source
AI summary
Methods and apparatuses for disassembling components are described. An apparatus in accordance with an aspect of the present disclosure comprises a first component including a first adhesive interface, a second component including a second adhesive interface, a joint between the first and second adhesive interfaces, the joint comprising an adhesive bonding to the first adhesive interface and to the second adhesive interface, such that the first component and the second component are joined together, and at least one thermal element in the adhesive, wherein the at least one thermal element is configured to weaken the joint by heating the adhesive when an energy is applied to the thermal element.