Thermal Enclosure Cooling for Autonomous Vehicle Computing Hardware

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Solution Overview

Problem

Existing environmental control systems in vehicles struggle to maintain safety-critical computing hardware within tight temperature and humidity limits, especially in autonomous driving systems, due to high costs of automotive-grade components, inefficiencies in temperature control during non-operation, and vulnerability to thermal shock and moisture condensation.

Innovation Solution

A thermal enclosure system with a cold plate, phase-change materials, and thermoelectric coolers to maintain component temperatures, combined with insulation and moisture management, ensuring consistent performance and safety.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If automotive-grade components are used to ensure reliability in extreme temperatures, then component reliability improves, but system cost increases significantly

Engineering Contradiction:
Improvecomponent reliabilityVSAvoidsystem cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the temperature parameter range that components must withstand by introducing thermal management infrastructure. Instead of requiring components to operate from -40°C to +150°C, the system maintains them within 0°C to +85°C using insulation, heating elements, and cooling mechanisms, allowing the use of less expensive industrial-grade components

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces thermal management infrastructure (insulation layers, heating elements, cooling systems) as an intermediary between the extreme external environment and the computing components. This intermediary protects components from temperature extremes, enabling the use of lower-cost components that wouldn't otherwise survive in automotive environments

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If air/liquid cooling systems are used to control high temperatures, then component temperature control improves, but the system cannot handle low-temperature storage or thermal shock

Engineering Contradiction:
Improvecomponent temperature controlVSAvoidtemperature range handling
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent creates a thermal management system that performs multiple functions: insulation protects against both heat gain and heat loss, heating elements address low-temperature conditions, and cooling systems address high-temperature conditions. This multi-functional approach allows the same infrastructure to handle the full range of temperature challenges including cold storage, thermal shock, and overheating

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses insulation as a cushioning layer that slows temperature changes, protecting components from thermal shock. The insulation creates a thermal buffer that prevents rapid temperature fluctuations, giving the system time to respond gradually to external temperature changes rather than experiencing abrupt shocks

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Object-affected harmful factors

If protective coatings are applied to prevent moisture condensation, then moisture resistance improves, but the coatings degrade over time and cannot be applied to metal contacts

Engineering Contradiction:
Improvemoisture resistanceVSAvoidcoating durability
Core Design Contradiction:
Object-affected harmful factorsVSDuration of action of stationary object

Solution Approach 1:

The patent extracts the moisture control function from surface coatings and relocates it to the thermal management infrastructure. By controlling temperature and humidity through heating elements, insulation, and ventilation, the system prevents condensation without requiring protective coatings on components or metal contacts, eliminating the durability and applicability limitations of coatings

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively maintains component temperatures within operational limits, mitigates thermal shock, and prevents moisture condensation, enhancing reliability and safety of autonomous driving systems.

Implementation Method 1

A thermal enclosure system with a cold plate, phase-change materials, and thermoelectric coolers to maintain component temperatures

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A thermal enclosure system with a cold plate, phase-change materials, and thermoelectric coolers to maintain component temperatures

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

phase-change materials, and thermoelectric coolers to maintain component temperatures

Methodology Applied
Scientific EffectLatent heat: Latent Heat

Implementation Method 4

A thermal enclosure system with a cold plate, phase-change materials, and thermoelectric coolers to maintain component temperatures

Methodology Applied
Scientific EffectThermoelectric effect: Peltier Effect

Implementation Method 5

combined with insulation and moisture management, ensuring consistent performance and safety

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12360580B2Environmental control system for computing hardware in an autonomous driving vehicle
Publication Date: 2025.07.15 BAIDU USA LLC
  • US12360580B2 patent drawing
  • US12360580B2 patent drawing
  • US12360580B2 patent drawing

AI summary

Embodiments are disclosed of a thermal enclosure for use in an autonomous driving vehicle (ADV). The thermal enclosure includes an enclosure having a top, a bottom, and an interior compartment having a floor and a ceiling. The thermal enclosure is adapted to be mounted in the ADV. An electronic component is positioned in the interior compartment and thermally coupled to the floor. A cold plate having a bottom surface, a top surface, an inlet, and an outlet, is positioned in the interior compartment with the bottom surface of the cold plate thermally coupled to the electronic component and with a gap between the top surface of the cold plate and the ceiling. The cold plate's inlet and the outlet are adapted to be fluidly coupled to a cooling system outside the thermal enclosure.