Thermal Enclosure for TIM Overflow in Chip Cooling
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Solution Overview
Problem
Current cooling apparatuses using thermal interface materials (TIMs) face challenges with chip warpage due to high heat fluctuations, leading to TIM overflow and reduced heat transfer efficiency, especially in high-speed applications with high power densities.
Innovation Solution
A cooling apparatus with a thermal enclosure surrounding the TIM layer, designed to accommodate chip warpage by providing outlets or pores for TIM overflow and using compressible materials to absorb pressure variations, thereby maintaining consistent heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are used to cool high-power-density chips, then heat dissipation effectiveness is improved, but implementation cost increases significantly
Solution Approach 1:
The patent employs a porous thermal interface material that allows controlled overflow of excess material through its pore structure. This eliminates the need for complex containment systems while maintaining effective thermal contact, reducing implementation cost without sacrificing heat dissipation performance.
Solution Approach 2:
The patent converts the harmful effect of chip warpage-induced TIM overflow into a beneficial feature by designing the TIM with controlled overflow characteristics. The overflow mechanism naturally accommodates warpage without requiring additional complex components, thereby reducing system complexity and cost while maintaining thermal effectiveness.
2Temperature
If rigid thermal interface materials are used between cooling device and chip, then thermal contact is improved, but chip warpage damage increases
Solution Approach 1:
The patent changes the mechanical parameters of the thermal interface material by incorporating a porous structure with controlled compliance. This allows the material to deform and accommodate chip warpage while maintaining sufficient thermal contact pressure, thus improving thermal contact without causing additional warpage damage.
Solution Approach 2:
The porous structure of the thermal interface material provides inherent compliance to accommodate chip warpage. The pores allow the material to deform elastically under stress, reducing mechanical damage from warpage while maintaining thermal pathways through the porous network.
3Stability of the object's composition
If thermal interface material is allowed to overflow freely, then chip warpage accommodation is improved, but heat transfer efficiency decreases
Solution Approach 1:
The porous thermal interface material provides controlled overflow through its pore structure, which maintains material containment while accommodating warpage. The porous network preserves thermal pathways even as the material deforms and overflows, thus maintaining heat transfer efficiency while improving warpage accommodation.
Solution Approach 2:
The thermal interface material combines thermal conductivity with controlled compliance through its composite porous structure. This allows the material to simultaneously accommodate warpage deformation and maintain effective thermal contact, preventing the trade-off between warpage accommodation and heat transfer efficiency.
4Temperature
If high pressure is applied to ensure thermal contact, then heat transfer is improved, but TIM pumpout increases
Solution Approach 1:
The patent changes the pressure distribution characteristics by using a porous thermal interface material that distributes applied pressure more uniformly. This reduces peak pressures that cause pumpout while maintaining sufficient overall contact pressure for effective heat transfer, thus improving thermal contact without increasing TIM loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal enclosure mitigates TIM overflow and pressure variations, enhancing heat transfer efficiency and extending the life expectancy of the cooling apparatus by accommodating repeated heating and cooling cycles.
Implementation Method 1
a thermal interface material layered between the cooling device and a chip
Implementation Method 2
the thermal enclosure may comprise a porous material including a plurality of pores configured to allow air to flow out of the thermal interface material
Implementation Method 3
the thermal enclosure may comprise a compressible thermal conductive material
Data Source
AI summary
A cooling apparatus for a chip package includes a cooling device, a thermal interface material, and a thermal enclosure. The thermal interface material is layered between the cooling device and the chip. The thermal enclosure is fixed between the cooling device and the chip surrounding the thermal interface material. The thermal enclosure is configured to provide an outlet for the thermal interface material therethrough. A method of manufacturing such a cooling apparatus is also provided.