Thermally Conductive Epoxy Composition With Silane-Mediated Crosslinking

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Solution Overview

Problem

Existing thermally conductive materials for power semiconductor devices have limitations in heat dissipation due to inadequate crosslinking polymerization reactions between phenol-based curing agents and epoxy monomers, leading to suboptimal thermal conductivity.

Innovation Solution

A thermally conductive material-forming composition comprising an epoxy compound, a phenolic compound with a high hydroxyl group content, and an inorganic substance like boron nitride, along with a surface modifier and curing accelerator, to enhance crosslinking and thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If phenol-based curing agent is used with boron nitride particles, then adsorptivity between curing agent and filler is improved, but crosslinking polymerization reaction is inhibited

Engineering Contradiction:

Improveadsorptivity between phenolic compound and inorganic substanceVSAvoidcrosslinking polymerization reaction

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

A silane coupling agent is introduced as an intermediary substance between the phenolic compound and boron nitride particles. The silane coupling agent has both organic functional groups that interact with the phenolic compound and inorganic bonding capability with boron nitride, thereby mediating the interaction and preventing direct adsorption that would inhibit crosslinking polymerization.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the chemical parameters of the system by introducing a silane coupling agent with specific functional groups. This modifies the interaction mechanism from direct hydrogen bonding (which inhibits crosslinking) to indirect coupling through the silane agent, allowing both good adhesion and proper crosslinking to occur simultaneously.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If hydroxyl group content in phenolic compound is increased to improve adsorption, then adsorptivity improves, but crosslinking reaction is more inhibited

Engineering Contradiction:

ImproveadsorptivityVSAvoidcrosslinking polymerization rate

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The silane coupling agent serves as a mediator that allows high hydroxyl group content phenolic compounds to maintain their adsorption capability while preventing these hydroxyl groups from directly competing with epoxy monomers for reaction sites, thus preserving crosslinking polymerization productivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If inorganic filler content is increased to improve thermal conductivity, then thermal conductive properties improve, but crosslinking polymerization is further inhibited

Engineering Contradiction:

Improvethermal conductivityVSAvoidcrosslinking polymerization reaction

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The silane coupling agent acts as a bridge between the increased inorganic filler content and the polymer matrix, allowing higher filler loading for improved thermal conductivity while maintaining adequate crosslinking polymerization through the intermediary coupling mechanism.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves improved thermal conductivity and adhesiveness, leading to enhanced heat dissipation in power semiconductor devices, addressing the limitations of previous materials.

Implementation Method 1

a hydroxyl group in the phenol-based curing agent is easily adsorbed with boron nitride due to hydrogen bond interaction or the like, which inhibits an appropriate crosslinking polymerization reaction

Methodology Applied

Scientific EffectAdsorption: Adsorption

Implementation Method 2

crosslinking polymerization reaction between the phenol-based curing agent and the epoxy monomer

Methodology Applied

Scientific EffectCrosslinking polymerization: Chemical Bonding

Implementation Method 3

improve thermally conductive properties

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3858885B1Composition for forming heat conductive materials, heat conductive material, heat conductive sheet, device with heat conductive layer, and film

Publication Date: 2024.05.08 FUJIFILM CORP

AI summary

The present invention provides a thermally conductive material-forming composition from which a thermally conductive material having excellent thermally conductive properties can be obtained. Moreover, a thermally conductive material formed of the thermally conductive material-forming composition, a thermally conductive sheet, and a device with a thermally conductive layer are provided. Further, the present invention provides a film from which a thermally conductive sheet having excellent thermally conductive properties can be prepared. Furthermore, a thermally conductive sheet prepared using the film, and a device with a thermally conductive layer are provided. The thermally conductive material-forming composition according to the embodiment of the present invention is a thermally conductive material-forming composition including an epoxy compound, one or more kinds of phenolic compounds selected from the group consisting of a compound represented by General Formula (1) and a compound represented by General Formula (2), and an inorganic substance, or the like.