Thermal Estimation Device for Chip Overheating Prevention
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Solution Overview
Problem
As complex chip systems with increased power consumption and circuit modules pose thermal management challenges, existing design methods fail to effectively estimate and optimize chip temperatures during the design stage, leading to potential overheating issues.
Innovation Solution
A thermal estimation device and method that includes a temperature model generator, temperature gradient calculator, and thermal sensing analyzer, which create a temperature model based on initial power consumption, area, and coordination of circuit modules, allowing for the estimation of optimized parameters to adjust chip design and prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more circuit modules are added to satisfy market demand, then system functionality is improved, but power consumption per unit area increases and thermal effects worsen
Solution Approach 1:
The patent applies preliminary action by performing thermal estimation and optimization during the Electronic System Level (ESL) design stage, before the chip is fabricated. The temperature estimation device calculates temperature distributions and identifies thermal issues early in the design process, allowing designers to adjust circuit module layouts and power consumption parameters proactively to prevent overheating problems before they occur in the final product.
2Temperature
If thermal optimization is performed after chip fabrication, then temperature issues can be addressed, but development time is extended and efficiency is reduced
Solution Approach 1:
The patent applies preliminary action by performing thermal estimation and optimization during the Electronic System Level (ESL) design stage, before the chip is fabricated. The temperature estimation device calculates temperature distributions and identifies thermal issues early in the design process, allowing designers to adjust circuit module layouts and power consumption parameters proactively to prevent overheating problems before they occur in the final product.
3Productivity
If thermal estimation is integrated into ESL design stage, then thermal optimization efficiency is improved, but device complexity increases
Solution Approach 1:
The patent applies mechanics substitution by replacing complex physical thermal measurement and iteration processes with a computational temperature estimation model. The device uses mathematical models to calculate temperature distributions based on power consumption data and layout information, substituting physical prototyping and measurement with virtual simulation, thereby reducing the need for repeated manufacturing cycles while managing design system complexity.
Data Source
AI summary
An embodiment of a thermal estimation device including a temperature model generator, a temperature gradient calculator, and a thermal sensing analyzer is disclosed. The temperature model generator generates a temperature model based on an initial power consumption, an initial area and an initial coordination of a circuit module. The temperature gradient calculator substitutes at least one of a testing area, a testing power or a testing coordinate of the circuit module into the temperature model for correspondingly estimating an temperature estimation function. The thermal sensing analyzer differentiates the temperature estimation function. When an absolute value of a differential result of the temperature estimation function resulted from a constant is closest to zero or is zero, outputting the constant as an optimized parameter.