Thermal Expansion Assembly with Insulating Layer

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Solution Overview

Problem

Conventional methods for joining metals, such as welding and bolted connections, are weak at the joint, difficult to disassemble, and prone to corrosion and electrical conductivity issues, leading to structural vulnerabilities and inefficiencies.

Innovation Solution

A structure formed by temperature difference using an enveloped part, an enveloping part, and a low heat transfer layer, where the enveloping part is heated to expand and then cooled to securely hold the enveloped part, reducing thermal conduction and facilitating easy assembly and disassembly, while also providing electrical insulation and corrosion protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional joining methods (welding, bonding, bolted connection) are used to join metals, then the metals can be connected, but the joint strength is weaker than the metal parts and the process is complicated

Engineering Contradiction:

Improvejoint strengthVSAvoidjoining process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent applies thermal expansion by heating the enveloping part to expand its internal cavity, allowing the enveloped part to be inserted easily. When cooled, the cavity contracts to securely hold the enveloped part, creating a strong joint without complex welding or bonding processes

Inventive Principle:

Principle #37Thermal expansion

Solution Approach 2:

The low heat transfer layer acts as an intermediary between the enveloping part and the enveloped part. It prevents excessive heat transfer during the thermal expansion process while allowing the enveloping part to expand sufficiently to facilitate assembly and disassembly

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If two dissimilar metals are in contact, then they can be connected, but galvanic corrosion weakens the joint over time

Engineering Contradiction:

Improveconnection easeVSAvoidjoint durability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The low heat transfer layer acts as a protective intermediary between dissimilar metals, preventing direct galvanic contact. This layer eliminates the galvanic cell effect while still allowing mechanical connection, thereby preventing corrosion and improving joint durability without complicating the manufacturing process

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional joining methods are used, then metals can be connected, but the process time is relatively long and equipment is expensive

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidassembly speed

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent replaces complex mechanical joining systems (welding equipment, bonding systems, bolted connection mechanisms) with a simple thermal expansion-based system. This substitution uses basic heating and cooling processes that can be performed with simple equipment, significantly reducing both equipment cost and process time while maintaining connection effectiveness

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure is robust, lightweight, and easily modifiable, allowing for quick assembly and disassembly, reducing part types and costs, and preventing corrosion and electrical shorts between dissimilar metals.

Implementation Method 1

The holding space can be thermally expanded to be larger than the engagement section of the enveloped part by heating the enveloping part

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

The low heat transfer layer, which has a thermal conductivity less than each of the enveloped part and the enveloping part, is disposed in the holding space, between the engagement section of the enveloped part and the enveloping part

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11493164B2Structure formed by temperature difference, method of forming the structure, and lightweight rigid assembly comprising the structure

Publication Date: 2022.11.08 MINTRON ENERGY TECH CO LTD

AI summary

A structure formed by temperature difference includes an enveloped part, an enveloping part, and a low heat transfer layer. The enveloped part has a free section and an engagement section. The enveloping part defines at least one holding space corresponding to the engagement section. The holding space is dimensioned to be slightly less than the engagement section and can be thermally expanded to be larger than the engagement section by heating the enveloping part to reach a predetermined temperature difference over the enveloped part, so that the engagement section can be put into the holding space. When the enveloping part is cooled, the holding space can shrink, causing the enveloping part to tightly hold the engagement section. The low heat transfer layer, which has a thermal conductivity less than each of the two parts, is disposed in the holding space, between the engagement section and the enveloping part.