Thermal Expansion Socket Assembly for Data Storage Heat Dissipation
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Solution Overview
Problem
The increasing power requirements of removable data storage devices (DSDs) lead to elevated temperatures, posing risks of damage to controllers and non-volatile memory, data loss, and user discomfort due to premature removal, which can result in errors during data access operations.
Innovation Solution
The design incorporates a thermally expanded assembly with a bi-metal material composition and Thermal Interface Material (TIM) that increases frictional resistance to removal and enhances heat dissipation, maintaining a safer operating temperature and preventing premature ejection of DSDs by using a thermally conductive and friction-increasing material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power usage of removable data storage devices is increased, then performance and functionality are improved, but temperature rises causing damage risk to controller and memory
Solution Approach 1:
The patent utilizes the phase transition of materials from solid to liquid state through thermal expansion. When the DSD operates at higher power and generates heat, the assembly material thermally expands and transitions to a liquid-like state, enabling it to flow and contact the DSD surface for heat dissipation through capillary action and thermal conduction.
Solution Approach 2:
The patent employs thermal expansion of the assembly material in response to heat generated by the DSD. As temperature increases, the assembly expands volumetrically, causing the material to rise and make contact with the DSD, thereby activating the heat dissipation mechanism while maintaining physical separation at normal operating temperatures.
2Power
If power usage of removable data storage devices is increased, then performance is improved, but reliability deteriorates due to data loss risk from premature removal
Solution Approach 1:
The patent introduces a thermal assembly as an intermediary substance between the DSD and the socket housing. This assembly material acts as a mediator that physically connects to the DSD when hot, preventing premature removal through friction and mechanical engagement, while not interfering with normal insertion and ejection operations at lower temperatures.
3Power
If power usage of removable data storage devices is increased, then functionality is improved, but user comfort deteriorates due to discomfort from removing hot DSD
Solution Approach 1:
The thermal assembly serves as a protective intermediary that the user contacts instead of the hot DSD itself. When the user inserts or removes the DSD, they touch the assembly material which has absorbed heat, reducing thermal transfer to the user's fingers and improving comfort while maintaining operational functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for increased power usage while maintaining a safer operating temperature, reducing the likelihood of data loss and user errors by preventing premature removal and effectively dissipating heat, thus ensuring reliable device operation.
Implementation Method 1
an assembly or retaining strip that helps remove heat from removable DSDs and/or increases a resistance to removing the DSD from the socket when the assembly or retaining strip is in a thermally expanded state
Implementation Method 2
The increased frictional resistance can be provided by a thermal interface material that comes into contact with the removable data storage device when the assembly is in the thermally expanded state
Data Source
AI summary
A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state.