Thermal Extraction Architecture for Compact Camera Heads

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Solution Overview

Problem

Camera heads and other electronic devices with heat-sensitive components often suffer from overheating due to inadequate heat extraction, leading to performance issues, component damage, and reduced lifespan, especially in enclosed and compact systems like pipe inspection cameras.

Innovation Solution

A thermal extraction architecture is implemented in camera heads, featuring a housing with thermal contact areas, printed circuit boards (PCBs) containing alternating thermal and electrical connecting layers, and a thermal extraction element that channels heat from the PCBs to the housing and external environment, reducing thermal resistance and redistributing heat effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If camera heads are made compact and enclosed for pipe inspection applications, then the device portability and sealing are improved, but heat extraction from sensitive components deteriorates

Engineering Contradiction:

Improvecamera head sizeVSAvoidcomponent temperature

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

A thermal extraction element is introduced as an intermediary component between the PCB and housing. This element provides a dedicated thermal conduction path that mediates heat transfer from heat-sensitive components through the PCB to the housing, enabling effective heat extraction despite the compact enclosed structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The PCB is segmented into multiple layers with alternating thermal extracting layers and insulating layers. This segmentation creates multiple thermal extraction pathways while maintaining electrical isolation, allowing heat to be conducted away from sensitive components through specific thermal layers without interfering with electrical connections.

Inventive Principle:

Principle #1Segmentation

2Temperature

If thermal extraction elements are added to PCBs, then heat extraction capability is improved, but device complexity increases

Engineering Contradiction:

Improveheat extraction efficiencyVSAvoidPCB structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal extraction function is merged into the PCB structure itself by integrating thermal extracting layers within the PCB laminate. This combining of thermal management functionality with the existing PCB structure avoids adding separate complex cooling systems while still achieving effective heat extraction.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The PCB serves multiple functions simultaneously: it provides electrical connections, structural support, and thermal extraction pathways. The alternating thermal and insulating layers enable the PCB to fulfill both electrical and thermal management roles, reducing the need for additional dedicated components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If thermal extracting layers are placed close to heat sensitive components, then heat extraction efficiency is improved, but electrical insulation requirements become more stringent

Engineering Contradiction:

Improvethermal resistanceVSAvoidelectrical insulation reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The PCB is divided into alternating thermal extracting layers and insulating layers. This segmentation places thermal extraction pathways close to heat-sensitive components for efficient heat removal while inserting insulating layers between thermal and electrical elements to maintain electrical isolation and prevent short circuits.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Insulating layers act as intermediary barriers between thermal extracting layers and electrical connecting layers. These intermediary insulating layers enable close proximity of thermal extraction elements to heat-sensitive components while maintaining the necessary electrical insulation to prevent interference with electrical signals and power.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces thermal resistance and extends the lifespan of heat-sensitive components by efficiently channeling heat away from sensitive areas, preventing overheating and maintaining performance in compact systems.

Implementation Method 1

a thermal extraction element disposed between the PCB and housing to transfer heat from the PCB to the housing and external environment

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10171712B2Thermal extraction architectures for camera and lighting devices

Publication Date: 2019.01.01 SEESCAN INC

AI summary

Thermal extraction architectures for heat-generating electronic devices such as digital cameras or lights are disclosed.