3D Thermal Heat Flow Mapping for Building Transmittance

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Solution Overview

Problem

Current methods for determining thermal quality in buildings, such as measuring thermal transmittance (U-value), are either invasive, time-consuming, or lack accuracy, especially for non-homogeneous elements and require extended periods for reliable results.

Innovation Solution

A method and equipment for generating an interactive three-dimensional thermal heat flow mapping that calculates thermal transmittance by using a combination of thermal imaging, ambient temperature measurement, and emissivity analysis, allowing for real-time and accurate assessment of heat flow across surfaces within a building environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional invasive methods are used to measure thermal transmittance, then measurement reliability is improved, but measurement time increases and the process becomes more complex

Engineering Contradiction:
Improvemeasurement reliabilityVSAvoidmeasurement time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces invasive physical measurement systems with non-contact infrared thermal imaging technology. The thermal camera captures surface temperature distributions without physical contact, while heat flow sensors measure thermal flux remotely. This substitution eliminates the need for invasive installations while maintaining measurement reliability through multiple sensing modalities working together.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system integrates multiple measurement functions into a single platform: infrared thermal imaging for surface temperature mapping, heat flow sensors for thermal flux measurement, and computational algorithms for U-value calculation. This multi-functional approach consolidates what would traditionally require separate measurement procedures into one comprehensive system, reducing overall measurement time while maintaining reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If traditional methods are used for thermal quality assessment, then measurement accuracy is improved for homogeneous elements, but the method becomes inapplicable or less accurate for non-homogeneous elements

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidapplicability to non-homogeneous elements
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality analysis by generating spatially-resolved thermal maps that show temperature variations across different locations on building elements. The system calculates U-values for specific regions rather than treating entire surfaces as uniform, allowing accurate assessment of non-homogeneous elements with varying thermal properties across their surfaces.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system transitions from point measurements to two-dimensional thermal mapping. By capturing temperature distributions across entire surfaces rather than single points, the patent enables assessment of non-homogeneous elements through spatial analysis of thermal patterns, providing both local and global thermal performance information.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of operation

If simple thermal imaging is used, then ease of operation is improved, but measurement precision deteriorates due to lack of comprehensive thermal parameters

Engineering Contradiction:
Improveoperational simplicityVSAvoidthermal transmittance accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent merges infrared thermal imaging with heat flow sensing and computational analysis. The system combines surface temperature data from the thermal camera with thermal flux measurements from heat flow sensors, then uses algorithms to calculate U-values. This integration maintains ease of operation through automated processing while achieving measurement precision by incorporating multiple thermal parameters.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system introduces computational algorithms as an intermediary between raw thermal imaging data and final U-value results. These algorithms process temperature distributions, account for environmental conditions, and calculate thermal transmittance values, thereby enhancing measurement precision while keeping the operational interface simple for users.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables rapid, accurate, and non-invasive determination of thermal transmittance, providing a detailed, three-dimensional representation of heat flow and thermal quality, improving upon the limitations of existing methods by offering immediate and precise results.

Implementation Method 1

generating a thermal image representing a surface temperature at multiple points on respective ones of the surfaces of the environment within the three-dimensional representation

Methodology Applied
Scientific EffectInfrared radiation: Infrared Radiation

Implementation Method 2

determining a measure for an ambient temperature within the environment can comprise measuring a temperature of a black body radiator within the environment

Methodology Applied
Scientific EffectBlack body radiation: Thermal Radiation

Implementation Method 3

Determining a measure of incident radiant temperature of the surfaces can comprise measuring a temperature of respective heat reflective structures on the surfaces

Methodology Applied
Scientific EffectRadiant heat transfer: Thermal Radiation

Implementation Method 4

calculating, at each of the multiple points, a value for the instantaneous heat flow per unit area using the measures for surface temperature, ambient temperature within the environment and incident radiant temperature of the surfaces

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12135242B2Thermal quality mappings
Publication Date: 2024.11.05 ELECTRICPOCKET
  • US12135242B2 patent drawing
  • US12135242B2 patent drawing
  • US12135242B2 patent drawing

AI summary

In some examples, a method for generating an interactive three-dimensional quantitative thermal heat flow mapping of an environment comprises generating a three-dimensional representation comprising multiple surfaces defining respective boundaries of the environment, generating a thermal image representing a surface temperature at multiple points of the surfaces, determining a measure for an ambient temperature within the environment, determining respective measures for incident radiant temperature of the surfaces, determining respective measures for the emissivity of the surfaces, providing a measure of temperature outside of a surface, calculating, at each of the multiple points, a value for the instantaneous heat flow per unit area using the measures for surface temperature, ambient temperature within the environment and incident radiant temperature of the surfaces, and using the values for the instantaneous heat flow per unit area, and the measure of temperature outside of a surface, calculating respective measures for thermal transmittance at the multiple points.