Thermal Flow Sensor Diaphragm Correction Circuit High-Frequency Ripple

The patent applies parameter changes by modifying the thermal capacity of the sensor through thin-film element design and bypass structure optimization. By adjusting the thermal capacity parameter, the sensor achieves faster response characteristics while maintaining measurement accuracy across different ripple conditions.

The patent implements dynamics by making the sensor responsive to dynamic flow conditions through the bypass structure that allows air to flow around the sensor element. This dynamic bypass mechanism enables the sensor to adapt to high-frequency rippling conditions while reducing response delay.

The patent applies local quality by creating different flow path characteristics in different regions of the sensor. The bypass structure provides a localized alternative flow path that compensates for response delay in normal conditions while the thin-film elements maintain accurate local temperature measurements even in high ripple amplitude regions.

The patent replaces the mechanical bypass flow compensation method with a thermal field-based correction approach. By using temperature difference measurements from upstream and downstream resistors, the system substitutes mechanical compensation with thermal field analysis to eliminate both lean and rich errors.

The patent replaces the mechanical bobbin structure with a thermal field-based detection system. By measuring temperature differences caused by heat transfer from the heater to the flowing air, the system detects flow direction and rate without mechanical moving parts, achieving both simplicity and accuracy.

The patent changes the detection parameter from mechanical displacement to thermal field characteristics. By monitoring temperature differences and heat transfer rates, the sensor achieves backward flow detection capability while maintaining a simple structure without mechanical components.