Thermal Flow Sensor Shielding Light Interference
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Solution Overview
Problem
Existing fluid handling devices lack accurate monitoring and control capabilities, particularly in 'lab on chip' systems and flow sensors, where precise fluid flow measurement and control are crucial but often compromised by external light interference and complex assembly processes.
Innovation Solution
A device comprising a channel substrate with integrated channels and a separate sensor substrate featuring a thermal flow sensor with a heater and temperature sensor, where the sensor is in thermal contact with the channel and shielded from visible and near-infrared light to enhance measurement accuracy, and a modular design that simplifies assembly by using a channel substrate with a cover layer and circuit paths for improved thermal and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature sensor is exposed to visible and near-infrared light, then the sensor can detect light signals, but the measurement accuracy is compromised due to light interference
Solution Approach 1:
The patent extracts the harmful light interference by introducing a shield that blocks visible and near-infrared light from reaching the temperature sensor. The shield is positioned between the light source and the sensor, effectively removing the harmful factor while preserving the sensor's functionality for accurate temperature measurement.
2Ease of manufacture
If the channel substrate and flow sensor are manufactured as separate components, then optimized manufacturing techniques can be applied to each part, but the assembly complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the device into separate channel substrate and sensor substrate components. Each substrate can be manufactured independently using optimized techniques for its specific function, and then assembled together. The modular design allows for specialized manufacturing processes for each component while maintaining overall system functionality.
3Measurement precision
If the heater and temperature sensor are not in thermal contact with the channel, then the sensor substrate can be positioned flexibly, but the flow measurement capability is lost
Solution Approach 1:
The patent introduces thermal contact elements as intermediaries between the heater/temperature sensor and the channel. These elements ensure efficient thermal coupling while allowing flexible positioning of the sensor substrate. The thermal contact mechanism enables accurate flow measurement by maintaining proper thermal pathways without constraining the overall device geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for precise monitoring and control of fluid flow, improved measurement accuracy by shielding temperature sensors from light interference, and simplified assembly by reducing the number of components and enabling optimized manufacturing techniques for each substrate.
Implementation Method 1
the heater and the temperature sensor are in thermal contact with the channel
Implementation Method 2
a shield blocking visible and near infrared light and preventing said light from reaching said temperature sensor
Data Source
AI summary
A channel substrate containing at least one channel for a fluid is provided. A sensor substrate carrying a thermal flow sensor is arranged adjacent to the channel substrate. The flow sensor contains at least one temperature sensor and at least one heater, which are integrated on the sensor substrate. The heater and the temperature sensor are in thermal contact with the channel in the channel substrate. This arrangement allows to measure the flow of the fluid in the channel, which provides an improved monitoring and control. The sensor substrate can have contact pads connected to bond wires or, using flip-chip technology, the contact pads can be connected to circuit paths to the channel substrate.