Thermal Fluid Switching for Rapid Microelectronic Temperature Control
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Solution Overview
Problem
Existing methods for setting and controlling the temperature of microelectronic devices during testing face challenges such as slow temperature transitions, inefficiencies, and non-uniformity due to the use of multiple thermal control fluids and complex thermal management systems, which hinder rapid and accurate temperature control, especially for high-power devices.
Innovation Solution
A method involving a temperature set and control apparatus with multiple thermal control circuits that maintain continuous flow of thermal transfer fluids at different temperatures, allowing for rapid switching between temperature settings by directing the fluids through a thermal head while ensuring uninterrupted flow and recirculation of exhausted fluid to maintain temperature stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple thermal control fluids are used to achieve different temperature set points, then temperature versatility is improved, but system complexity and transition time increase
Solution Approach 1:
The thermal control system is segmented into multiple independent thermal control circuits, each capable of maintaining a different temperature set point. This allows the system to switch between temperature set points by selecting which circuit connects to the thermal head, rather than using a single complex circuit with multiple heating/cooling elements.
Solution Approach 2:
The system dynamically switches between different thermal control circuits based on the desired temperature set point. The switching mechanism allows rapid transition between temperature regimes by connecting the appropriate pre-conditioned thermal fluid circuit to the thermal head, eliminating the need to heat or cool a single circuit in place.
2Loss of energy
If thermal control fluid flow is stopped between tests, then energy consumption is reduced, but temperature transition time increases
Solution Approach 1:
Thermal control circuits are pre-conditioned to their respective temperature set points before being needed. Each circuit continuously maintains its designated temperature, so when a particular temperature is required, the corresponding pre-conditioned circuit can be immediately connected to the thermal head without requiring heating or cooling time.
Solution Approach 2:
The thermal control circuits continuously circulate thermal fluid even when not currently connected to the thermal head. This continuous circulation maintains the fluid at the desired temperature and prevents thermal equilibrium with the environment, enabling rapid switching between temperature set points without idle cooling or heating delays.
3Adaptability or versatility
If resistive heating elements are used to add heat to the thermal head, then temperature control flexibility is improved, but thermal uniformity deteriorates
Solution Approach 1:
A thermal control fluid acts as an intermediary between the heat source and the thermal head. The fluid is heated in an external heat exchanger and then circulated through the thermal head, providing uniform heat distribution. This eliminates the need for direct contact heating elements that would create localized hot spots and thermal gradients on the device surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid and efficient temperature changes with improved thermal settling time and uniformity, reducing idle time between tests and enhancing the reliability of microelectronic device testing by maintaining precise temperature control across various test conditions.
Implementation Method 1
a thermal transfer apparatus with an apparatus intake to receive thermal transfer fluid, an apparatus exhaust to output thermal transfer fluid, and a conduit to conduct thermal transfer fluid from the apparatus intake to the apparatus exhaust through the thermal transfer apparatus
Implementation Method 2
flowing a first thermal transfer fluid in a first thermal control circuit at a first temperature, and flowing a second thermal transfer fluid in a second thermal control circuit at a second temperature
Data Source
AI summary
One embodiment of the present invention is a method for setting and controlling temperature of a device that includes: (a) thermally contacting the device to a heat transfer apparatus, the heat transfer apparatus having an apparatus intake to receive thermal transfer fluid, an apparatus exhaust to output thermal transfer fluid, and a conduit to conduct thermal transfer fluid from the apparatus intake to the apparatus exhaust through the heat transfer apparatus; (b) flowing a first thermal transfer fluid in a first thermal control circuit at a first temperature, and flowing a second thermal transfer fluid in a second thermal control circuit at a second temperature; (c) at a first predetermined time, directing the first thermal transfer fluid to flow to the apparatus intake, and from the apparatus exhaust back to the first thermal control circuit and the second thermal transfer fluid to flow in the second thermal control circuit without flowing to the apparatus intake; and (d) at a second predetermined time, directing the second thermal transfer fluid to flow to the apparatus intake, and from the apparatus exhaust back to the second thermal control circuit and the first thermal transfer fluid to flow in the first thermal control circuit without flowing to the apparatus intake.