Multi-Path Thermal Fluid Control for Rapid Device Temperature Cycling
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Solution Overview
Problem
Current methods for rapid thermal conditioning of electronic devices during testing are inefficient, as they either heat and cool the test head simultaneously, require energy-intensive air heating and cooling, or involve inefficient mixing of thermal transfer fluids, leading to prolonged testing times and increased costs.
Innovation Solution
An apparatus with a thermal fluid path, temperature sensor, and valve assembly that regulates the flow of thermal transfer fluid through heating and cooling paths to precisely control the temperature of the device under test, using a low-capacity, high-conductivity thermal head and a closed-loop system to conserve energy and achieve rapid temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If resistive heating is used to heat the test head, then temperature can be raised rapidly, but the test head must be cooled simultaneously which reduces thermal efficiency
Solution Approach 1:
The patent divides the thermal control system into separate heating and cooling paths. The heating path uses resistive heating elements while the cooling path uses a separate fluid circulation system with heat exchangers. This segmentation allows independent optimization of each path, enabling rapid temperature changes without the energy waste of simultaneous heating and cooling.
Solution Approach 2:
The patent introduces a thermal transfer fluid as an intermediary between the heating/cooling systems and the test head. The fluid circulates through channels in the test head, absorbing or delivering thermal energy as needed. This intermediary allows precise thermal control by regulating fluid flow rate and temperature, avoiding direct resistive heating of the test head which would require simultaneous cooling.
2Speed
If air is heated and cooled to provide rapid thermal conditioning, then temperature control speed improves, but energy consumption increases significantly
Solution Approach 1:
The patent uses a liquid thermal transfer fluid circulated through hydraulic-like pathways in the test head, replacing air-based thermal conditioning systems. The liquid fluid has higher heat capacity and thermal conductivity than air, enabling more efficient heat transfer with lower energy consumption. The closed-loop circulation system with pumps and heat exchangers provides rapid thermal response without the energy waste of heating and cooling large volumes of air.
3Adaptability or versatility
If hot and cold thermal transfer fluids are mixed to achieve intermediate temperatures, then temperature control flexibility improves, but the mixing process is inefficient
Solution Approach 1:
The patent implements feedback control by sensing the temperature of the thermal transfer fluid and adjusting the flow rates through heating and cooling paths accordingly. Temperature sensors monitor the fluid temperature, and this information feeds back to controllers that modulate valve positions and pump speeds. This closed-loop feedback enables precise temperature control without wasteful mixing, as the system dynamically balances heating and cooling flows to achieve the desired temperature efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and rapid temperature control of electronic devices, minimizing testing time and costs by optimizing thermal transfer fluid flow and energy usage, while maintaining precise temperature settings.
Implementation Method 1
a first path in thermal contact with a heating assembly, which first path is fluidly connected at a first end to the thermal fluid path; a second path in thermal contact with a cooling assembly
Implementation Method 2
a thermal fluid path which transfers a thermal transfer fluid so that the device is heated or cooled in response to the thermal transfer fluid
Implementation Method 3
a valve assembly being operable, in response to the controller, to regulate flow of thermal transfer fluid flow through the first, the second, and the third paths
Implementation Method 4
a temperature sensor in communication with a controller and being operable to sense a temperature in response to the thermal fluid path
Data Source
AI summary
Apparatus to control device temperature wherein a thermal fluid path transfers a thermal transfer fluid to heat or cool the device; wherein a first path in thermal contact with a heating assembly is fluidly connected at a first end to the thermal fluid path, a second path in thermal contact with a cooling assembly is fluidly connected at a first end to the thermal fluid path, a third path is fluidly connected at a first end to the thermal fluid path, and a valve assembly regulates flow of thermal transfer fluid flow through the first, the second, and the third paths.