Embedded Thermal Frame Inductor for Direct Heat Conduction
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Solution Overview
Problem
Existing inductor structures face challenges in achieving uniform thermal contact, require thermal interface materials that increase thermal resistance, and have inefficient heat dissipation due to complex heat transfer paths, limiting their performance in high-power-density applications.
Innovation Solution
An inductor with a high thermal conductivity frame embedded in magnetic powder material, featuring a top and bottom plate with vertical frames, directly integrated during manufacturing, eliminating the need for thermal interface materials and providing a direct heat conduction path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metallic band is wrapped around the inductor after manufacturing, then thermal contact can be established, but manufacturing precision deteriorates due to difficulty in achieving perfect contact and exact 90-degree angles at bends
Solution Approach 1:
The frame is pre-formed with precise 90-degree angles and integrated directly into the inductor structure during manufacturing, eliminating the need for post-assembly wrapping and ensuring uniform thermal contact from the outset
Solution Approach 2:
The frame and inductor are integrated as a single unified structure during manufacturing, combining the thermal management function with the inductor structure itself, thereby ensuring perfect thermal contact without separate assembly steps
2Temperature
If thermal interface material is used to connect the metallic band to the inductor, then thermal contact is achieved, but thermal resistance increases due to the low thermal conductivity of TIM and gaps at band endpoints
Solution Approach 1:
The thermal interface material is completely removed from the system. The frame makes direct contact with the inductor and electronic components through its integrated structure, eliminating the thermal resistance introduced by TIM layers
Solution Approach 2:
The frame integrates the functions of both the metallic band and thermal interface material into a single direct-contact structure, eliminating the need for separate TIM layer and reducing thermal resistance at interfaces
3Ease of manufacture
If the metallic band surrounds only the sides of the inductor, then manufacturing is simplified, but heat transfer path length increases, increasing thermal resistance and degrading heat dissipation performance
Solution Approach 1:
The frame extends in multiple dimensions with vertical portions contacting the inductor body and horizontal portions providing thermal pathways, creating a three-dimensional thermal management structure that shortens heat transfer paths while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conduction efficiency by shortening heat transfer paths, reducing thermal resistance, and improving heat dissipation performance, particularly in high-power-density electronic components.
Implementation Method 1
the frame being embedded within the first magnetic powder material; wherein the apparatus is disposed above an electronic component and is in contact with the electronic component through the bottom plate of the frame
Data Source
AI summary
The present invention provides an apparatus having an inductor and a high thermal conductivity frame, and a manufacturing method thereof. The apparatus comprises: an inductor having at least two internal conductors, the inductor being embedded in magnetic powder material; and a frame made of a high thermal conductivity material, the frame including a top plate located above the at least two internal conductors, bottom plate located below the at least two internal conductors, and at least one connecting bar between the top plate and the bottom plate, with the frame embedded within the magnetic powder material; wherein the apparatus is disposed above an electronic component and is in contact with the electronic component through the bottom plate of the frame.