Thermal Gap Filler and Conductive Casing for Hand-Held Device Heat Dissipation
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Solution Overview
Problem
Hand-held devices face challenges in thermal management due to increased power consumption and size constraints, leading to elevated temperatures, performance deterioration, and reliability issues, as traditional active cooling solutions like fans are impractical in these devices.
Innovation Solution
A passive thermal solution involving a thermally conductive casing and a thermal gap filler with a thermal conductivity of at least 1 W/m-K, which facilitates heat transfer from electronic components to the casing for dissipation, often using materials like acrylate resin or silicone, and may incorporate a heat spreader and EMI shield to enhance thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional features are added to hand-held devices to provide multiple modes of communication and organization, then functionality is improved, but power consumption increases leading to thermal management challenges
Solution Approach 1:
The patent combines the structural housing with thermal management functionality by making the casing thermally conductive. The housing serves dual purposes: mechanical protection and heat dissipation pathway, eliminating the need for separate active cooling components.
Solution Approach 2:
The device housing performs thermal management functions passively through its inherent thermal conductivity. The structure serves itself by conducting heat away from internal components without requiring external power or active control mechanisms.
2Temperature
If active cooling solutions like fans are used to dissipate heat, then temperature control is improved, but device complexity and power consumption increase
Solution Approach 1:
The patent removes active cooling components (fans, pumps) from the system entirely. Instead, it extracts and utilizes the thermal management function through passive thermal conduction pathways integrated into the device structure.
Solution Approach 2:
The patent replaces mechanical active cooling systems with a passive thermal conduction system. Heat is dissipated through thermal conduction via the housing and gap filler materials rather than through mechanical convection using fans.
3Loss of energy
If traditional thermal management techniques are used, then heat dissipation is achieved, but thermal contact resistance at interfaces reduces efficiency
Solution Approach 1:
The patent introduces a thermally conductive gap filler material as an intermediary between internal components and the housing. This mediator fills voids and improves thermal contact, enabling more efficient heat transfer across the interface.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the gap filler material to optimize heat transfer. By selecting materials with specific thermal conductivity properties, the system achieves improved thermal contact and reduced thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the temperature of hand-held devices, preventing performance degradation and ensuring reliable operation by efficiently dissipating heat through the thermally conductive casing and gap filler, outperforming current thermal management techniques.
Implementation Method 1
a thermal gap filler positioned between a portion of the thermally conductive casing and the electronic package to facilitate heat transfer from the electronic package to the thermally conductive casing
Data Source
AI summary
The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.