Thermal Gap Pad with Resilient Core for Variable Heat Transfer

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Solution Overview

Problem

Portable computing devices face inefficiencies in heat distribution due to trapped heat in isolated areas, especially when components are separated by gaps, limiting their operational time and performance, as conventional thermally conductive materials are not well-suited for bridging variable gaps and ensuring effective heat transfer.

Innovation Solution

A thermal gap pad is created by wrapping a thermally conductive layer, such as synthetic graphite, around a resilient core, forming a composite structure that can accommodate varying distances and provide efficient heat conduction between separated components, while the flexible wrapper and adhesive ensure secure attachment and prevent graphite dust contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If components are separated by gaps to improve device assembly and layout flexibility, then device design flexibility is improved, but heat transfer efficiency deteriorates because heat transfer is limited to convection and radiation which are substantially less efficient than thermal conduction

Engineering Contradiction:
Improvedevice design flexibilityVSAvoidheat transfer efficiency
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

A thermal gap pad is introduced as an intermediary component between separated heat-generating components and other device portions. The gap pad includes a compressible core that bridges the physical gap and a thermally conductive layer that provides a thermally conductive pathway, enabling efficient heat transfer through the gap without requiring direct component contact or active cooling devices.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal gap pad employs a composite structure combining a compressible core material with a thermally conductive layer. This composite design allows the gap pad to simultaneously provide mechanical compliance for gap bridging and high thermal conductivity for efficient heat transfer, resolving the contradiction between maintaining design flexibility and ensuring heat transfer efficiency.

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If conventional thermally conductive sheets are used to spread heat across surfaces, then in-plane heat distribution is improved, but effectiveness deteriorates when bridging gaps between separated subassemblies because these sheets are not well suited for vertical or gap-spanning heat transfer

Engineering Contradiction:
Improvein-plane heat distributionVSAvoidgap-bridging capability
Core Design Contradiction:
Loss of energyVSAdaptability or versatility

Solution Approach 1:

The thermal gap pad is segmented into two functional components: a compressible core for gap bridging and a thermally conductive layer for heat transfer. This segmentation allows each component to optimize its specific function while working together to solve both in-plane heat distribution and gap-bridging requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from conventional two-dimensional planar heat spreaders to a three-dimensional structure with vertical height. The compressible core provides the necessary height to span gaps between subassemblies, while the thermally conductive layer maintains effective heat transfer pathways in the vertical dimension, enabling the gap pad to function where conventional sheets fail.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If a rigid thermally conductive material is used to bridge gaps, then thermal conduction efficiency is improved, but adaptability deteriorates because rigid materials cannot accommodate variable gap distances or conform to different component geometries

Engineering Contradiction:
Improvethermal conduction efficiencyVSAvoidgap distance accommodation
Core Design Contradiction:
Loss of energyVSAdaptability or versatility

Solution Approach 1:

The compressible core of the thermal gap pad is designed to be dynamically adaptable, allowing it to compress and expand to accommodate variable gap distances. This dynamic property enables the same gap pad to effectively bridge different gap sizes while maintaining consistent thermal contact and conduction efficiency through the thermally conductive layer.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The gap pad utilizes parameter changes in the compressible core's physical state (compression ratio, density) to adapt to different installation conditions. As the core is compressed to different degrees, it changes its physical parameters to conform to varying gap distances and component geometries while the thermally conductive layer maintains optimal thermal pathways throughout the compression range.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables robust and flexible heat transfer pathways, effectively distributing heat across components, even when they are not in direct contact, thereby maintaining efficient operation and extending the device's peak performance time.

Implementation Method 1

The thermally conductive layer conducts heat between the first and second components

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a resilient core

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS9445528B2Thermal gap pad
Publication Date: 2016.09.13 APPLE INC
  • US9445528B2 patent drawing
  • US9445528B2 patent drawing
  • US9445528B2 patent drawing

AI summary

This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.