One-Component Thermal Gel Composition for High Conductivity and Stability

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Solution Overview

Problem

Current thermal interface materials, particularly two-component dispensable gap fillers, face challenges in achieving a balance between high thermal conductivity, processability, and reliability, often resulting in limited shelf life, hardening, cracking, and device failure due to their two-part curing systems and vulnerability to thermal and power cycling.

Innovation Solution

A one-component thermal gel composition comprising a crosslinkable organopolysiloxane, a hydrolyzable organopolysiloxane, a thermal conductivity enhancing agent, and optional additives, which provides high thermal conductivity while maintaining processability and reliability by controlling vertical slippage, cracking, and delamination across various application gaps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If two-component dispensable gap fillers are used to achieve high thermal conductivity, then thermal performance is improved, but shelf life is limited and device failure occurs due to hardening and cracking

Engineering Contradiction:
Improvethermal conductivityVSAvoidshelf life and device stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent extracts the harmful curing process from the thermal interface material formulation. By using a single-component system with latent crosslinking capability, the material eliminates the need for two-component mixing and immediate curing, thereby extending shelf life while maintaining thermal conductivity performance.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the chemical state parameters of the polysiloxane system by using hydrolyzable organopolysiloxane with controlled moisture sensitivity. This allows the material to remain stable during storage and only undergo crosslinking when exposed to controlled moisture conditions, resolving the contradiction between thermal performance and reliability.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If softer silicone gap fillers are used to reduce contact resistance and thermal impedance, then heat management is improved, but creep behavior increases under compression

Engineering Contradiction:
Improvethermal impedanceVSAvoidcreep resistance
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent introduces dynamic properties to the gap filler material through controlled crosslinking. The material transitions from a soft, compliant state during application to a more structured, creep-resistant state after curing, while maintaining low modulus characteristics. This dynamic adaptation resolves the contradiction between thermal performance and compositional stability.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent creates a composite structure within the polysiloxane system by combining low-modulus base polymer with crosslinking agents and conductivity enhancing fillers. This composite approach allows the material to exhibit both softness for thermal contact and structural integrity for creep resistance.

Inventive Principle:
Principle #40Composite materials

3Ease of operation

If thermal grease materials are used for filling interstitial space due to good compressibility and low cost, then ease of application is improved, but pump-out and dry-out occur during thermal cycling

Engineering Contradiction:
Improvecompressibility and application easeVSAvoidresistance to pump-out and dry-out
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies preliminary crosslinking preparation to the thermal interface material. By incorporating hydrolyzable organopolysiloxane that begins crosslinking upon exposure to moisture, the material pre-establishes a gel network structure that prevents pump-out and dry-out during thermal cycling, while maintaining ease of application during the uncured state.

Inventive Principle:
Principle #10Preliminary action

4Ease of manufacture

If one-component thermal gel composition is used to simplify the curing process, then ease of manufacture is improved, but achieving high thermal conductivity while maintaining processability becomes challenging

Engineering Contradiction:
Improvecuring process simplicityVSAvoidthermal conductivity and processability balance
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent merges multiple functions into a single-component system: the organopolysiloxane serves as both the base polymer and the crosslinking agent through its hydrolyzable groups. This consolidation simplifies manufacturing while enabling high thermal conductivity through proper filler incorporation and maintaining processability through controlled gel formation.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves enhanced dispensability, thermal conductivity (4-10 W/mK), and reliability, addressing the limitations of existing materials by ensuring long-term stability and ease of application without the need for complex curing processes.

Implementation Method 1

a hydrolysable organopolysiloxane selected from a compound of formula (II), formula (III), or a combination therefore

Methodology Applied
Scientific EffectHydrolysis: Hydrolysis

Data Source

PatentUS20240059843A1Thermal gel composition
Publication Date: 2024.02.22 MOMENTIVE PERFORMANCE MATERIALS INC
  • US20240059843A1 patent drawing
  • US20240059843A1 patent drawing
  • US20240059843A1 patent drawing

AI summary

A one-component thermal gel composition comprising a crosslinked silicone gel, a hydrolyzable siloxane, a thermal conductivity enhancing agent, and optionally one or more additives is described.