Thermal Gel Dispensing Lid with Constriction Gap for Optoelectronics
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Solution Overview
Problem
Micro-electronic and micro-optical devices generate heat, which can cause optical misalignments and damage if not managed properly, and existing thermal gels are difficult to control and apply accurately on small devices without dispersing onto sensitive components.
Innovation Solution
An optoelectronic assembly with a lid featuring a dispense channel and a gel groove, where a thermal gel with filler materials is applied between the lid and the micro-device, preventing dispersion onto sensitive components through a constriction gap, ensuring controlled heat transfer and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal gel is applied on micro-devices to aid heat transfer, then heat dissipation efficiency is improved, but the thermal gel disperses onto sensitive components causing potential damage
Solution Approach 1:
The lid is segmented into multiple functional features: a dispense channel for controlled gel delivery, a gel groove for containing the gel, and a constriction gap to limit gel spread. This segmentation allows the thermal gel to be applied effectively while preventing dispersion onto sensitive components.
Solution Approach 2:
The lid acts as an intermediary structure between the thermal gel and the sensitive components. By incorporating the dispense channel, gel groove, and constriction gap, the lid mediates the interaction between gel and components, enabling heat transfer while blocking gel dispersion paths.
2Temperature
If conventional thermal gel application methods are used, then heat transfer is achieved, but manufacturing precision and component protection are compromised
Solution Approach 1:
The lid is pre-configured with the dispense channel and gel groove structure before thermal gel application. This preliminary preparation ensures that when gel is applied, it follows the predetermined path and remains contained, achieving high manufacturing precision without requiring complex application processes.
3Temperature
If more thermal gel is applied to improve heat dissipation, then heat transfer efficiency increases, but the risk of gel contacting sensitive components increases
Solution Approach 1:
The lid structure provides different local qualities: the dispense channel allows gel flow in specific directions, the gel groove provides containment with specific volume, and the constriction gap creates a physical barrier. This local differentiation enables sufficient gel quantity for heat transfer while maintaining component protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively restricts thermal gel application to precise areas, preventing contact with sensitive components and maintaining optical alignment, while facilitating efficient heat dissipation from micro-devices.
Implementation Method 1
Compliant thermal gels and greases have been developed in order to aid the heat transfer from the micro-devices to a heat dispersion component such as a lid
Data Source
AI summary
An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.