Thermally Enhanced Glass Substrate for Integrated Circuit Heat Dissipation
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Solution Overview
Problem
Electronic devices, particularly integrated circuits, face challenges in effectively dissipating heat without interfering with their operation due to the low thermal conductivity of traditional substrates like glass, which can lead to device damage.
Innovation Solution
A thermally enhanced substrate is created by forming a thermally conductive insulating layer, such as diamond, aluminum nitride, or zinc oxide, on a glass substrate, with metal layers and thermal bumps that extend through these layers to couple with a thermal enhancement ring, providing a path for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass substrate is used, then electrical insulation is provided, but thermal conductivity is low leading to heat accumulation
Solution Approach 1:
The patent applies composite materials by combining glass substrate with thermally conductive insulating layers (such as diamond, aluminum nitride, or boron nitride). This composite structure maintains the electrical insulation properties of glass while introducing materials with high thermal conductivity to enable effective heat dissipation from the electronic device.
2Temperature
If thermally conductive materials are added, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The patent segments the thermal management function by introducing discrete thermally conductive insulating layers and thermal bumps rather than requiring a complete redesign of the substrate. This modular approach allows heat dissipation to be added as separate functional elements, reducing the overall complexity increase.
Solution Approach 2:
The thermally conductive insulating layer acts as an intermediary between the glass substrate and the metal layers/thermal bumps. This intermediary layer provides both thermal conduction pathways and electrical insulation, simplifying the design by combining multiple functions in a single component rather than requiring separate elements.
3Temperature
If thermal bumps extend through metal layers, then thermal pathways are created, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by forming the thermally conductive insulating layer before depositing the metal layers and creating thermal bumps. This sequential approach allows each subsequent layer to be formed with reference to the previously established layer, facilitating better alignment and reducing precision requirements during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from electronic devices, preventing damage while maintaining electrical insulation and enabling high-density inductor fabrication for applications like 5G RF filters, improving thermal management without interfering with device operation.
Implementation Method 1
a thermally conductive insulating layer is formed on a surface of the glass substrate
Implementation Method 2
a plurality of thermal bumps extend through the at least one metal layer and couple to the thermally conductive insulating layer
Data Source
AI summary
Aspects generally relate to an integrated circuit including a glass substrate. On a surface of the glass substrate a thermally conductive insulating layer is formed. At least one metal layer is formed above the thermally conductive insulating layer, and a plurality of thermal bumps extend through the at least one metal layer and couple to the thermally conductive insulating layer to dissipate heat from the substrate.