On-Chip Thermal Gradient Patch Clamp

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Solution Overview

Problem

Current patch clamp technologies for investigating ion channels lack precise temperature control, which is essential for drug discovery and ion channel-related disease research, as they rely on heating the surrounding fluid, leading to delays and reduced precision.

Innovation Solution

Integration of a thermoelectric element, such as a Peltier device, directly on the patch clamp substrate near the cell membrane allows for localized temperature control, enabling both heating and cooling and the establishment of temperature gradients across the cell membrane.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the temperature of the surrounding fluid is changed to investigate temperature gradients, then temperature control is achieved, but there is a delay and reduced precision in temperature control

Engineering Contradiction:
Improvetemperature control precisionVSAvoidtemperature adjustment delay
Core Design Contradiction:
TemperatureVSLoss of time

Solution Approach 1:

The patent applies local quality by integrating a thermoelectric element directly onto the patch clamp substrate at the specific location where temperature control is needed (proximate to the cell membrane). This localized heating/cooling approach allows precise temperature control of the cell membrane without requiring bulk fluid temperature changes, thereby eliminating the delay and achieving rapid, precise temperature adjustments.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The thermoelectric element serves as an intermediary device between the control system and the cell membrane. Instead of directly heating/cooling the surrounding fluid, the thermoelectric element is positioned to provide direct thermal interaction with the cell membrane region, enabling precise and rapid temperature control while isolating the bulk fluid temperature from the measurement process.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If a thermoelectric element is integrated with the substrate, then precise localized temperature control is achieved, but device complexity increases

Engineering Contradiction:
Improvelocalized temperature controlVSAvoidsubstrate integration complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The thermoelectric element provides multiple functions: it can both heat and cool the cell membrane region by reversing the current direction, and it can establish temperature gradients across the membrane. This multi-functionality in a single component reduces the need for separate heating and cooling systems, thereby managing device complexity while achieving precise localized temperature control.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides more precise temperature control, reducing delays and enabling a wider range of experimental possibilities by allowing for active and rapid temperature adjustments, thereby enhancing drug screening and ion channel research.

Implementation Method 1

A thermal element is fixed to the outer surface of the substrate proximate to the opening and adapted to heat a cell membrane positioned on the opening according to a received electrical signal

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS8696881B2Patch-clamp providing on-chip thermal gradient
Publication Date: 2014.04.15 WISCONSIN ALUMNI RES FOUND
  • US8696881B2 patent drawing
  • US8696881B2 patent drawing
  • US8696881B2 patent drawing

AI summary

A patch clamp system providing precise and rapid temperature control of constrained cell membranes employs the thermal element attached to the substrate of the patch clamp. In one embodiment, the thermal element is a Peltier device fabricated on a silicon membrane wafer bonded to the substrate of the patch clamp.