Thermally Conductive Silicone Grease Dispensing and Heat Removal
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Solution Overview
Problem
Current thermally conductive silicone grease compositions face challenges in achieving both low viscosity for easy dispensing and printing, while maintaining sufficient thermal conductivity to effectively remove heat from electronic components.
Innovation Solution
A thermally conductive silicone grease composition is developed by combining a specific organopolysiloxane with a non-silicone type organic compound having a higher solubility parameter and a thermally conductive inorganic filler, optimizing the ratio and properties to achieve low viscosity and high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the viscosity of thermal grease is lowered to obtain good dispensing or printing performance, then the dispensing ability is improved, but the content of thermally conductive inorganic filler is limited, making it impossible to ensure sufficient thermal conductivity
Solution Approach 1:
The patent uses a composite base oil system combining silicone oil and fluorinated oil in specific ratios (70:30 to 90:10 by weight). This composite approach allows the formulation to achieve both low viscosity for good dispensing performance and high capacity for thermally conductive filler, resolving the contradiction between ease of operation and thermal conductivity reliability
Solution Approach 2:
The patent optimizes multiple parameters including the base oil composition ratio, filler particle size distribution (combining fine particles 0.1-10μm with coarse particles 10-50μm), and filler content (50-80 parts by weight per 100 parts base oil). These parameter changes enable the grease to maintain low viscosity while incorporating sufficient thermally conductive filler
2Reliability
If the content of thermally conductive inorganic filler is increased to ensure sufficient thermal conductivity, then the thermal conductivity is improved, but the viscosity increases, making dispensing or printing difficult
Solution Approach 1:
The patent employs a dual particle size filler system with fine particles (0.1-10μm) and coarse particles (10-50μm) in optimized ratios. This parameter optimization allows high filler content (50-80 parts per 100 parts base oil) while maintaining low viscosity through improved filler packing efficiency and reduced aggregation
Solution Approach 2:
The combination of silicone oil and fluorinated oil creates a composite base oil with enhanced lubricating properties and lower viscosity. This composite material system can support high filler loads while maintaining dispensability, resolving the contradiction between thermal conductivity and ease of operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits excellent dispensing ability, printability, and thermal conductivity, making it suitable for efficient heat removal from electronic components without compromising stability or flowability.
Implementation Method 1
combining a specific organopolysiloxane, a non-silicone type organic compound having a solubility parameter higher than that of the organopolysiloxane, and a thermally conductive inorganic filler
Implementation Method 2
thermally conductive inorganic filler having an average particle size of from 0.5 to 100 μm, in an amount of from 200 to 2,000 parts by weight per 100 parts by weight of components (A) and (B) combined
Data Source
AI summary
A heat-conductive silicone grease composition comprising (A) an organopolysiloxane in an amount of 20 to 90 parts by mass, (B) a non-silicone-type organic compound in an amount of 80 to 10 parts by mass (wherein the total amount of the components (A) and (B) is 100 parts by mass) and (C) a heat-conductive inorganic filler having an average particle diameter of 0.5 to 100 μm in an amount of 200 to 2,000 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B), wherein the SP value of the non-silicone-type organic compound (B) is greater than that of the organopolysiloxane (A) (i.e., (B)>(A)), the value obtained by subtracting the SP value of the component (A) from the SP value of the component (B) is greater than 2, and the viscosity of the heat-conductive silicone grease composition is 50 to 1,000 Pa·s at 25° C.