Thermal Ground Plane with Variable Ionized Fluid Flow Control
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Solution Overview
Problem
Existing thermal ground planes and vapor chambers face challenges in maintaining optimal ionized fluid volume to balance heat transfer efficiency and thermal resistance across varying electronic device workloads.
Innovation Solution
A thermal ground plane incorporating an electromagnetic source that dynamically regulates the amount of excess ionized fluid from a reservoir to a vapor chamber, based on thermal resistance and temperature, to maintain an optimized fluid volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a higher volume of water is charged into the vapor chamber, then the maximum heat transfer coefficient (Qmax) increases, but the thermal resistance of the vapor chamber increases leading to higher case temperature and poorer temperature uniformity
Solution Approach 1:
The patent implements a reservoir connected to the vapor chamber that allows dynamic adjustment of the water volume. The reservoir enables the system to transition from a fixed water charge to a variable water charge, where the volume of water in the vapor chamber can be adjusted based on operating conditions. This dynamic configuration allows optimization of both Qmax and thermal resistance by adjusting water volume to match different power levels and thermal requirements.
2Temperature
If a lower volume of water is charged into the vapor chamber, then the thermal resistance decreases, but the maximum heat transfer coefficient (Qmax) decreases limiting performance under high-power conditions
Solution Approach 1:
The reservoir configuration enables dynamic adjustment of water volume to match operating conditions. When high power levels are required, additional water can be supplied from the reservoir to maintain high Qmax. When lower power levels operate, the water volume can be reduced to maintain low thermal resistance. This dynamic adaptability resolves the contradiction between maintaining high heat transfer capacity and low thermal resistance across varying operating conditions.
Solution Approach 2:
The system changes the parameter of water volume dynamically based on operating conditions. By adjusting the water volume parameter between a range defined by the reservoir capacity, the system can optimize performance for different power levels, transitioning between states of high Qmax/high thermal resistance and low Qmax/low thermal resistance as needed.
3Power
If the water charge is increased to handle high-power applications, then the heat transfer capacity improves, but the system becomes less adaptable to lower power levels with poor temperature uniformity
Solution Approach 1:
The reservoir-based system provides dynamic adaptability to varying power levels. The water volume can be adjusted in real-time or between operating states to match the current power level requirements. This enables the same vapor chamber design to serve both high-power and low-power applications optimally, rather than requiring different designs for different power ranges.
Solution Approach 2:
The reservoir configuration makes the vapor chamber system universal across multiple power levels and application scenarios. A single system design with adjustable water volume can handle a wide range of input power levels, eliminating the need for multiple specialized designs and improving overall system versatility and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient thermal management by dynamically adjusting ionized fluid volume, optimizing heat transfer capacity, and maintaining uniform temperature across varying device workloads.
Implementation Method 1
an electromagnetic source configured to dynamically direct a variable amount of excess ionized fluid from a reservoir
Implementation Method 2
Vapor chambers (VC) and thermal ground planes (TGP) in phase change cooling systems
Implementation Method 3
optimizing heat transfer capacity
Implementation Method 4
maintaining uniform temperature across varying device workloads
Data Source
AI summary
A thermal ground plane (TGP), including: a vapor chamber containing an ionized fluid; a reservoir fluidly connected with the vapor chamber, configured to store excess ionized fluid; and an electromagnetic source configured to dynamically direct a variable amount of the excess ionized fluid from the reservoir to the vapor chamber based on a thermal resistance of the ionized fluid in the vapor chamber or a temperature of the TGP at a location proximate to a heat source.


