Thermal Ground Plane Phase Separation Heat Dissipation
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Solution Overview
Problem
Current cooling systems face challenges in efficiently managing non-uniform heat generation and limited spatial access for heat dissipation in electronic and optical devices, leading to performance and reliability issues due to excessive heating.
Innovation Solution
The implementation of a thermal ground plane structure with a phase separation system, comprising a vapor-filled area and a liquid-filled area separated by a semi-permeable structure, and a porous high thermal conductivity structure that absorbs and transfers thermal energy through capillary action, enabling efficient heat dissipation and spreading across a large area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling with heat sinks is used to dissipate heat, then heat dissipation capability is improved, but the device volume and weight increase due to extended surfaces
Solution Approach 1:
The patent employs phase change heat transfer (liquid to vapor transition) within the thermal ground plane structure to achieve high heat dissipation capability. The phase change process absorbs large amounts of latent heat, enabling effective cooling without requiring external heat sinks or extended surfaces, thus maintaining compact device volume.
Solution Approach 2:
The invention extracts the heat dissipation function from external components (heat sinks) and integrates it directly into the substrate plane itself. The thermal ground plane structure performs both heat spreading and phase-change heat dissipation functions internally, eliminating the need for separate external cooling components.
2Temperature
If extended surfaces (fins) are added to increase heat transfer area, then heat dissipation is improved, but the vertical space availability is reduced
Solution Approach 1:
Instead of extending heat transfer surfaces vertically (adding fins in the vertical dimension), the patent utilizes the horizontal plane dimension by spreading heat laterally across a large area of the substrate. The phase change process occurs throughout the planar structure, effectively using the two-dimensional plane for heat dissipation rather than requiring vertical extension.
Solution Approach 2:
The phase change mechanism provides high heat transfer coefficient within the constrained vertical space. The latent heat absorption during vaporization occurs throughout the liquid-filled pores of the thermal ground plane, achieving high heat dissipation density without requiring additional vertical clearance for extended surfaces.
3Temperature
If cooling methods are designed for localized hot-spots, then local heat management is improved, but the system complexity increases
Solution Approach 1:
The thermal ground plane structure serves multiple functions simultaneously: it acts as both a heat spreader and a phase-change heat dissipation device. The same porous structure that distributes heat laterally also contains the liquid coolant and facilitates vaporization, eliminating the need for separate cooling systems for different regions.
Solution Approach 2:
The invention merges the heat spreading function and the heat dissipation function into a single integrated structure. The porous thermal ground plane simultaneously conducts heat laterally and enables phase-change cooling, combining what would traditionally require separate components into one unified system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves high effective thermal conductivity and low across-the-plane thermal resistance, effectively managing heat dissipation by converting thermal energy into vapor, which is then condensed and dissipated externally, maintaining a nearly isothermal plane with minimal temperature variation.
Implementation Method 1
the porous high thermal conductivity structure absorbs liquid through capillary action so that liquid from the liquid-filled area is communicated into a portion of the porous high thermal conductivity structure that extends into the vapor-filled area
Implementation Method 2
the porous high thermal conductivity structure transfers the thermal energy to the liquid in the porous high thermal conductivity structure to form a vapor
Implementation Method 3
the vapor is communicated through the semi-permeable structure into the liquid-filled area, wherein the vapor condenses into the liquid
Data Source
AI summary
Thermal ground planes, thermal ground plane structures, and methods of thermal energy management, are disclosed. Embodiments of the disclosure provide for thermal ground planes and/or thermal ground plane structures for both fully passive and active two-phase heat spreaders, as well as the cooling devices and thermal management methods enabled by these planes and/or structures that enable heat dissipation from one or more high heat flux domains followed by spreading the heat laterally over a large area achieving essentially the spatially isothermal plane, structure, system, or device.