Thermal Head Adapters for Independent Zone Control
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Solution Overview
Problem
Current test systems for IC chips struggle to independently control the temperature and force of multiple components within close proximity, leading to inadequate thermal management and performance deviations during testing, especially in complex devices like system-on-chip (SOC) with varying power dissipation and structural complexities.
Innovation Solution
A thermal head system comprising multiple adapters, heaters, and thermal controllers that allow independent temperature and force control of each component, using adapters with different thermal interface materials and force mechanisms to maintain precise control without affecting neighboring components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single adapter or plurality of adapters with the same properties is used, then the device complexity is reduced, but the thermal control precision of individual components deteriorates
Solution Approach 1:
The thermal head is divided into multiple independent adapters, each capable of being thermally coupled to different components. This segmentation allows each adapter to independently control the temperature of its associated component, resolving the contradiction between device complexity and thermal control precision by creating modular, independently controllable units.
Solution Approach 2:
Each adapter is equipped with its own heater and thermal controller, enabling localized thermal control for each component. This local quality approach ensures that each component receives customized thermal management according to its specific requirements, maintaining high thermal control precision without requiring a completely complex centralized system.
2Productivity
If components are placed within close proximity to increase integration density, then the productivity is improved, but the thermal management capability deteriorates
Solution Approach 1:
The thermal head is divided into multiple independent adapters, each capable of being thermally coupled to different components. This segmentation allows each adapter to independently control the temperature of its associated component, resolving the contradiction between device complexity and thermal control precision by creating modular, independently controllable units.
Solution Approach 2:
Each adapter is equipped with its own heater and thermal controller, enabling localized thermal control for each component. This local quality approach ensures that each component receives customized thermal management according to its specific requirements, maintaining high thermal control precision without requiring a completely complex centralized system.
3Device complexity
If a single thermal control system is used for all components, then the device complexity is reduced, but the measurement precision of individual component performance deteriorates
Solution Approach 1:
The thermal head is divided into multiple independent adapters, each capable of being thermally coupled to different components. This segmentation allows each adapter to independently control the temperature of its associated component, resolving the contradiction between device complexity and thermal control precision by creating modular, independently controllable units.
Solution Approach 2:
Each adapter is equipped with its own heater and thermal controller, enabling localized thermal control for each component. This local quality approach ensures that each component receives customized thermal management according to its specific requirements, maintaining high thermal control precision without requiring a completely complex centralized system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and independent thermal management of components with different set point temperatures and power dissipation levels, ensuring accurate testing and performance evaluation in complex IC chip structures.
Implementation Method 1
one or more heaters thermally coupled to the plurality of adapters and the one or more components of the one or more devices under test
Implementation Method 2
one or more cold plates thermally coupled to the plurality of adapters, wherein the one or more cold plates are configured to cool the plurality of adapters
Data Source
AI summary
Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.