Thermal Head Adhesion via Inorganic Particle Bridging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing thermal heads face challenges in maintaining the adhesion between the inorganic protective layer and the resin cover layer, leading to potential separation under external forces, which can affect the printer's performance and durability.

Innovation Solution

Incorporating inorganic particles with a first portion inside the cover layer and a second portion inside the protective layer, these particles enhance the adhesion between the conductive layer and the cover layer by increasing the contact area and ensuring the particles remain embedded, even under external forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a protective layer formed of inorganic material and a cover layer formed of resin material are used, then the thermal head structure is established, but the adhesion between the protective layer and cover layer is insufficient under external forces

Engineering Contradiction:

Improveadhesion strength between protective layer and cover layerVSAvoidresistance to separation under external forces

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The invention uses inorganic particles (such as alumina or silica) dispersed within the resin cover layer to create a composite material structure. These particles act as a bridge between the inorganic protective layer and the resin cover layer, enhancing interfacial adhesion through mechanical interlocking and chemical bonding, thereby resolving the adhesion insufficiency between the two layers

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The inorganic particles are strategically positioned at the interface region between the protective layer and cover layer, creating localized reinforcement zones. This local quality enhancement focuses the adhesion improvement precisely where the interface bonding is needed, without compromising the overall properties of either layer

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the adhesion strength between the protective and cover layers, reducing the likelihood of separation and enhancing the thermal head's durability and performance.

Implementation Method 1

Inorganic particles disposed on a surface of the protective layer so as to protrude from the surface... each comprise a first portion located inside the cover layer and a second portion located inside the protective layer

Methodology Applied

Scientific EffectMechanical interlocking:

Data Source

PatentUS10144224B2Thermal head and thermal printer

Publication Date: 2018.12.04 KYOCERA CORP

AI summary

A thermal head according to the disclosure includes: a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate so as to be electrically connected to the heat generating section; a protective layer which covers the heat generating section and part of the electrode, the protective layer being formed of an inorganic material; a cover layer disposed on the protective layer, the cover layer being formed of a resin material; and inorganic particles disposed on a surface of the protective layer so as to protrude from the surface. Moreover, the inorganic particles each comprise a first portion located inside the cover layer and a second portion located inside the protective layer.