Thermal Head Bonding Structure for Durable Electrode Connections
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Solution Overview
Problem
Existing thermal heads and printers lack durability in their connection structures, which affects their reliability and longevity.
Innovation Solution
A thermal head design featuring a substrate with a heat storage layer, conductive members, and a bonding material containing gold and tin, along with a heat dissipation body, enhances durability by improving the bonding strength and thermal response characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional connection structure is used in the thermal head, then the manufacturing process is simple, but the durability and reliability are insufficient
Solution Approach 1:
The patent employs a multi-layer composite connection structure consisting of an aluminum electrode layer, a bonding material layer containing gold and tin, and an electrically conductive member layer. This composite material approach enhances durability and reliability by combining materials with complementary properties: aluminum provides electrical conductivity and cost-effectiveness, while the gold-tin bonding material provides superior bonding strength and corrosion resistance. The layered composite structure resolves the contradiction by achieving enhanced reliability without requiring complex external reinforcement mechanisms.
2Strength
If the bonding material contains gold and tin, then the bonding strength is improved, but the manufacturing cost increases
Solution Approach 1:
The patent applies the local quality principle by using the expensive gold-tin bonding material only in the specific region where enhanced bonding strength is critical - namely, at the interface between the aluminum electrode and the electrically conductive member. This localized application of high-performance material ensures reliable electrical connection and mechanical bonding where needed, while avoiding the use of expensive materials throughout the entire thermal head structure. This resolves the contradiction by achieving necessary bonding strength at the critical interface without proportionally increasing overall manufacturing cost.
Solution Approach 2:
The patent optimizes the composition parameters of the bonding material by specifying particular ratios and combinations of gold and tin, along with controlled amounts of other elements. By carefully adjusting these compositional parameters, the invention achieves optimal bonding strength that meets reliability requirements while controlling material costs. The parameter optimization allows the use of a cost-effective formulation that provides sufficient bonding performance without requiring excessive amounts of expensive precious metals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced durability and thermal response characteristics improve the reliability and longevity of the thermal head, ensuring consistent printing performance.
Implementation Method 1
The bonding material is positioned on the substrate and contains gold and tin. The electrically conductive member is positioned on the bonding material. The aluminum electrode is positioned on the substrate and is electrically connected to the electrically conductive member via the bonding material.
Implementation Method 2
a substrate, a bonding material, an electrically conductive member, and an aluminum electrode. The bonding material is positioned on the substrate and contains gold and tin... a thermal head design featuring a substrate with a heat storage layer
Implementation Method 3
there is known a connection structure of an electronic component in which an aluminum wiring positioned on a substrate is plated and bonded using a bonding material
Data Source
AI summary
A thermal head includes a substrate, a bonding material, an electrically conductive member, and an aluminum electrode. The bonding material is positioned on the substrate and contains gold and tin. The electrically conductive member is positioned on the bonding material. The aluminum electrode is positioned on the substrate and electrically connected to the electrically conductive member via the bonding material.