Thermal Head Conductive Layer Segmentation for Heat Dissipation
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Solution Overview
Problem
Thermal heads face inefficiencies in heat transfer from heat generating parts to recording media, leading to excessive power consumption and reduced electrical reliability due to heat dissipation through conductive patterns.
Innovation Solution
A recording head design featuring a conductive layer with a connecting part and a wiring part, where the wiring part has a smaller cross-sectional area than the connecting part, reducing heat dissipation and enhancing electrical reliability by ensuring effective heat utilization and conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the conductive pattern is made narrow to prevent heat dissipation, then heat transfer efficiency is improved, but electrical reliability deteriorates
Solution Approach 1:
The conductive pattern is segmented into two distinct parts: a connecting part with larger cross-sectional area for electrical reliability, and a wiring part with smaller cross-sectional area for heat dissipation prevention. This segmentation allows each part to fulfill its specific function optimally without compromising the other.
Solution Approach 2:
Different parts of the conductive pattern are given different local qualities: the connecting part has larger dimensions for electrical stability, while the wiring part has smaller dimensions for thermal isolation. This local differentiation resolves the contradiction by optimizing each region for its primary function.
2Loss of energy
If the amount of heat generated is increased to transfer sufficient heat to the recording medium, then heat transfer efficiency is improved, but power consumption increases
Solution Approach 1:
The harmful heat dissipation pathway through the conductive pattern is extracted and eliminated by designing the wiring part with minimal cross-sectional area. This removes the energy loss channel, allowing efficient heat transfer to the recording medium without excessive power consumption.
3Loss of energy
If the cross-sectional area of the wiring part is reduced to minimize heat dissipation, then heat transfer efficiency is improved, but electrical conduction reliability worsens
Solution Approach 1:
The conductive pattern is divided into connecting part and wiring part, each with optimized cross-sectional areas for their respective functions. The connecting part ensures electrical reliability while the wiring part minimizes heat dissipation, resolving the contradiction through functional segmentation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively utilizes heat generated in heat generating parts, reducing power consumption and improving electrical reliability by minimizing heat dissipation through the wiring part and ensuring conduction even when cracks appear.
Implementation Method 1
a conductive layer electrically connected to each of the heat generating parts. The conductive layer includes a connecting part and a wiring part
Implementation Method 2
forming an image by transferring the heat generated in each heat generating part to the recording medium such as heat sensitive paper
Data Source
AI summary
A thermal head includes heat generating parts and a conductive layer having connecting parts electrically connected to ends of the heat generating parts. The conductive layer has wiring parts whose cross-sectional areas are smaller than cross-sectional areas of the respective connecting parts in directions. The wiring parts has a first upper layer and a second upper layer which have smaller widths in arrow directions than widths of the respective connecting parts as well as a first lower layer and a second lower layer which have lengths not shorter than the widths of the respective connecting parts and greater than the widths of the respective upper layers. The respective upper layers and the respective lower layers are arranged to overlap each other.