Thermal Head Cover Member Voids for Thermal Stress Relief
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Solution Overview
Problem
High-definition thermal printing requires increased processing of electric signals, leading to high temperatures that can damage the cover member around driving ICs in thermal heads, causing sealing failures due to thermal expansion and contraction, which affects the reliability of the thermal head.
Innovation Solution
The thermal head incorporates a cover member with voids in its structure, specifically first, second, and third portions, which moderate compression and tensile stresses during thermal expansion and contraction, reducing the likelihood of damage and maintaining the sealing property of the driving ICs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high-definition thermal printing is performed with increased electric signal processing, then printing quality is improved, but thermal head temperature increases causing cover member damage and sealing failure
Solution Approach 1:
The cover member incorporates voids (air pockets) within its structure to create a porous configuration. These voids act as thermal insulation regions that reduce heat transfer to the driving ICs and surrounding sealing areas, allowing high-definition printing while preventing thermal damage and maintaining sealing integrity
Solution Approach 2:
The voids in the cover member serve as an intermediary thermal barrier between the heat-generating driving ICs and the external environment. This intermediate structure moderates thermal stress and prevents direct heat transmission that would otherwise cause sealing failure
2Temperature
If continuous thermal expansion and contraction occurs during operation, then thermal stress is generated, but the cover member structure is damaged reducing reliability
Solution Approach 1:
The porous structure with embedded voids provides thermal stress relief during expansion and contraction cycles. The voids compress and expand with temperature changes, absorbing mechanical stress and preventing structural damage to the cover member while maintaining sealing properties
Solution Approach 2:
The voids are pre-positioned within the cover member structure to anticipate and cushion against thermal expansion stresses before they cause damage. This preventive design allows the cover member to withstand repeated thermal cycling without degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The voids in the cover member effectively reduce the risk of damage from thermal stress, maintaining the sealing integrity of the driving ICs and preventing failures, even under high-definition printing conditions.
Implementation Method 1
thermal expansion and contraction
Implementation Method 2
moderate compression and tensile stresses
Data Source
AI summary
A thermal head includes: a substrate; a heat generating section which is disposed on the substrate; a plurality of driving ICs including first and second driving ICs which are disposed on the substrate and electrically coupled to the heat generating section; and a cover member covering the first and second driving ICs. The cover member is disposed in an inter-driving IC region between the first driving IC and the second driving IC and above and below the inter-driving IC region, and includes a first void.