Thermal Head Covering Layer Height Variation for Sealability

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Solution Overview

Problem

The existing thermal heads have low sealability due to the covering layer being formed apart from the bulging portion, which leads to reduced protection and potential corrosion of components.

Innovation Solution

A thermal head design with a covering layer comprising a first portion disposed apart from the bulging portion and a second portion between the bulging portion and the first portion, where the height of the second portion from the substrate is smaller than the height of the first portion, enhancing sealability and preventing corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the covering layer is formed apart from the bulging portion, then the heating element can function properly, but the sealability is low leading to potential corrosion

Engineering Contradiction:

ImprovesealabilityVSAvoidcorrosion risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The covering layer is designed with a height dimension variation, where the first portion has a greater height than the second portion. This dimensional change allows the covering layer to extend over the bulging portion effectively, improving sealability while maintaining the functional gap needed for heating element operation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The covering layer has different heights in different regions: the first portion has a greater height for enhanced sealing, while the second portion has a smaller height to accommodate the bulging portion. This local quality variation resolves the contradiction between sealability and functional operation.

Inventive Principle:

Principle #3Local quality

2Reliability

If the covering layer is formed closer to the bulging portion, then sealability improves, but it may interfere with recording medium transportation

Engineering Contradiction:

ImprovesealabilityVSAvoidrecording medium transportation

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The covering layer employs local quality variation with different heights in different regions. The first portion has greater height for sealing, while the second portion has reduced height to avoid interfering with recording medium transportation, thus resolving the contradiction between sealability and operational ease.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

By introducing height as a dimensional variable, the covering layer can provide enhanced sealing in the first portion while maintaining adequate clearance in the second portion for smooth recording medium transportation, eliminating the need to choose between sealability and operational ease.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10160228B2Thermal head and thermal printer with improved sealability

Publication Date: 2018.12.25 KYOCERA CORP

AI summary

A thermal head includes a substrate, a heat storage layer disposed on the substrate and including a bulging portion, heating elements disposed on the bulging portion, a protective layer disposed on the heating elements, and a covering layer disposed on the protective layer. The covering layer includes a first portion disposed apart from the bulging portion, and a second portion disposed between the bulging portion and the first portion. The height of the second portion from the substrate is smaller than the height of the first portion from the substrate.