Thermal Head Substrate Edge Reinforcement for Crack Prevention
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Solution Overview
Problem
Thermal heads face the possibility of chipping or cracking at the edge portion of the substrate, which affects their reliability and performance.
Innovation Solution
A thermal head design that includes a substrate with reinforcing members on its edge portions, where the first reinforcing member is part of the common electrode and the second reinforcing member is a ground electrode, providing structural support and reducing stress, thereby minimizing the risk of chipping or cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate is used without reinforcing members, then the device complexity is reduced, but the substrate edge portion becomes susceptible to chipping or cracking
Solution Approach 1:
Reinforcing members are provided on the substrate before the heat generating members are formed, so that the substrate edge is strengthened in advance before any thermal or mechanical stress is applied during operation. This preliminary reinforcement prevents chipping or cracking from occurring at the vulnerable edge portions.
Solution Approach 2:
The reinforcing members are specifically positioned only at the edge portions of the substrate where chipping or cracking is most likely to occur, rather than reinforcing the entire substrate uniformly. This localized reinforcement approach addresses the specific vulnerability at the edges while minimizing additional complexity in other areas.
2Productivity
If multiple thermal heads are manufactured from a single substrate, then productivity is improved, but the risk of chipping or cracking at substrate edges increases
Solution Approach 1:
The reinforcing members are established on the substrate before it is divided into multiple thermal heads, ensuring that each resulting thermal head inherits the edge reinforcement. This preliminary reinforcement strategy maintains substrate integrity throughout the manufacturing process and in the final divided products.
Solution Approach 2:
The substrate is divided into multiple thermal heads after the reinforcing members have been formed, allowing the reinforcement structure to be distributed across multiple units. This segmentation approach enables high productivity while each individual thermal head retains the protective reinforcing members at its edges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the likelihood of substrate edge chipping or cracking, enhancing the reliability and durability of the thermal head, even when multiple thermal heads are manufactured from a single substrate.
Implementation Method 1
A first reinforcing member and a second reinforcing member which is separated from the first reinforcing member are provided on the edge portion of the first main surface of the substrate
Data Source
AI summary
A thermal head and a thermal printer are disclosed. The head includes a substrate, heat generating members, an edge portion, and first and second reinforcing members. The substrate includes: first and second surfaces opposing to each other; and an end face connecting the first and second surfaces. The heat generating members are parallel to the end face and located on the substrate. The edge portion is located on the substrate, crosses an array direction of the heating generating members, and includes first, second and third edge portions on the first main surface, the second main surface and the first end face, respectively. The first reinforcing member is located on the first, second and third edge portions. The second reinforcing member is located on the first edge portion, and separated from the first reinforcing member.