Thermal Head Multi-Pad for Probe Inspection
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Solution Overview
Problem
Existing thermal heads face challenges in efficiently managing the resistance value and performing multiple electrical inspections without easily breaking or increasing material costs, particularly due to the limitations of single probe connections and wire bonding processes.
Innovation Solution
The thermal head incorporates multi-pads with distinct regions for wire connection and probe attachment, allowing for separate connections for multiple probes and reducing the length of the connecting wire, thereby enhancing inspection accuracy and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single pad structure is used for both wire connection and probe connection, then the device complexity is reduced, but the reliability deteriorates due to easy breaking during repeated inspections
Solution Approach 1:
The pad is divided into a first region for wire connection and a second region for probe connection. This segmentation allows the pad to serve multiple functions while maintaining structural integrity, as each region can be optimized for its specific purpose, thereby improving reliability during repeated inspections without significantly increasing overall device complexity
Solution Approach 2:
The pad is designed as a multi-functional component with a first region connected to the wire and a second region connected to multiple probes. This multi-functionality allows a single pad structure to handle both wire bonding and electrical inspections, improving reliability by distributing stress and connection points across different regions
2Reliability
If multiple separate pads are used for wire connection and probe connection, then the reliability improves, but the device complexity increases
Solution Approach 1:
The first region and second region are merged into a single integrated pad structure that is connected to the electrode. This merging reduces device complexity by eliminating the need for separate pads while maintaining the functional separation and reliability benefits of having distinct connection regions for wires and probes
3Ease of operation
If the wire length is increased to accommodate multiple probe connections, then the ease of operation improves, but the productivity deteriorates due to longer wire bonding time
Solution Approach 1:
The pad structure utilizes spatial arrangement in multiple dimensions, with the first region and second region positioned at different locations on the substrate. This dimensional arrangement allows multiple probes to connect to different regions without requiring excessively long wires, thereby maintaining ease of operation while reducing wire bonding time and improving productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables repeated resistance measurements and electrical inspections without easily breaking the thermal head, reduces material costs, and shortens wire bonding time, improving inspection accuracy and thermal response characteristics.
Implementation Method 1
a plurality of heat generating portions 9, an electrode 19... The plurality of heat generating portions 9 are positioned on the substrate 7 and arranged in a main scanning direction. The electrode 19 is positioned on the substrate 7 and electrically coupled to each of the plurality of heat generating portions 9
Data Source
AI summary
A thermal head includes a substrate, a plurality of heat generating portions, electrodes, pads, driving ICs, and a wire. The plurality of heat generating portions are positioned on the substrate and arranged in a main scanning direction. The electrodes are positioned on the substrate and electrically coupled to each of the plurality of heat generating portions. The pads are positioned on the substrate and coupled to the electrodes. The driving ICs drive the heat generating portions. The wire couples the driving ICs and the electrodes to each other. The thermal head according to the present disclosure includes a plurality of the pads. At least one of the pads is a multi pad that has a first region to which the wire is connected and a second region to which each of a plurality of probes is connected.